Case 2:17-cv-04263-JVS-JCG Document 1-4 Filed 06/08/17 Page 1 of 12 Page ID #:71
`
`
`
`Exhibit D
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`
`
`
`

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`Case 2:17-cv-04263-JVS-JCG Document 1-4 Filed 06/08/17 Page 2 of 12 Page ID #:72
`I IIIII IIIIIIII Ill lllll lllll lllll lllll lllll lllll lllll lllll 111111111111111111
`US007524087Bl
`
`c12) United States Patent
`Aizar et al.
`
`(IO) Patent No.:
`(45) Date of Patent:
`
`US 7,524,087 Bl
`Apr. 28, 2009
`
`(54) OPTICAL DEVICE
`
`(75)
`
`Inventors: Abdul Karim NorfidathulAizar,
`Penang (MY); Chiau Jin Lee, Penang
`(MY); Keat Chuan Ng, Penang (MY);
`Kiam Soon Ong, Penang (MY); Kheng
`Leng Tan, Penang (MY)
`
`(73) Assignee: Avago Technologies ECBU IP
`(Singapore) Pte. Ltd., Singapore (SG)
`
`6,459,130 Bl*
`10/2002
`6,486,543 Bl*
`11/2002
`6,707,069 B2 *
`3/2004
`7,071,620 B2 *
`7/2006
`7,282,740 B2 * 10/2007
`2008/0121921 Al*
`5/2008
`2008/0170391 Al*
`7/2008
`
`257/432
`Arndt et al. .................
`257/684
`Sano et al. ..................
`257/79
`Song et al. ....................
`Devos et al.
`................ 313/512
`Chikugawa et al. ........... 257/79
`Loh et al.
`.....................
`257/99
`Norfidathul et al. ......... 362/227
`
`( *) Notice:
`
`Subject to any disclaimer, the term ofthis
`patent is extended or adjusted under 35
`U.S.C. 154(b) by O days.
`
`* cited by examiner
`Primary Examiner-Thomas M Sember
`
`(21) Appl. No.: 11/941,406
`
`(22) Filed:
`
`Nov. 16, 2007
`
`(51)
`
`Int. Cl.
`F21V 29/00
`(2006.01)
`(52) U.S. Cl. ....................... 362/267; 362/310; 257/676;
`257/684; 257/99; 257/100
`(58) Field of Classification Search ................. 362/267,
`362/310, 800; 257/678, 684, 676, 81, 82,
`257/98, 99, 100
`See application file for complete search history.
`
`(56)
`
`References Cited
`
`U.S. PATENT DOCUMENTS
`
`(57)
`
`ABSTRACT
`
`An exemplary embodiment of an optical device may include
`a lead frame with a plurality of leads and a reflector housing
`formed around the lead frame. The reflector housing includes
`a first end face and a second end face and a peripheral sidewall
`extending between the first end face and the second end face.
`The reflector housing includes a first pocket with a pocket
`opening in the first end face and a second pocket with a pocket
`opening in the second end face. At least one LED die is
`mounted in the first pocket of the reflector housing, and a light
`transmitting encapsulant is disposed in the first pocket and
`encapsulating the at least one LED die.
`
`5,298,768 A *
`
`3/1994 Okazaki et al ................
`
`257/81
`
`19 Claims, 6 Drawing Sheets
`
`r10
`
`42
`
`r10
`
`50
`
`

`

`Case 2:17-cv-04263-JVS-JCG Document 1-4 Filed 06/08/17 Page 3 of 12 Page ID #:73
`
`U.S. Patent
`
`Apr. 28, 2009
`
`Sheet 1 of 6
`
`US 7,524,087 Bl
`
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`,10
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`20
`
`50
`
`62
`
`46
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`60
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`42
`FIG.1
`
`FIG. 2
`
`

`

`Case 2:17-cv-04263-JVS-JCG Document 1-4 Filed 06/08/17 Page 4 of 12 Page ID #:74
`
`U.S. Patent
`
`Apr. 28, 2009
`
`Sheet 2 of 6
`
`US 7,524,087 Bl
`
`20
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`70
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`74
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`84 86 88
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`64
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`FIG. 4
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`94
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`

`

`Case 2:17-cv-04263-JVS-JCG Document 1-4 Filed 06/08/17 Page 5 of 12 Page ID #:75
`
`U.S. Patent
`
`Apr. 28, 2009
`
`Sheet 3 of 6
`
`US 7,524,087 Bl
`
`100
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`102
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`FIG. 6
`
`

`

`Case 2:17-cv-04263-JVS-JCG Document 1-4 Filed 06/08/17 Page 6 of 12 Page ID #:76
`
`U.S. Patent
`
`Apr. 28, 2009
`
`Sheet 4 of 6
`
`US 7,524,087 Bl
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`Case 2:17-cv-04263-JVS-JCG Document 1-4 Filed 06/08/17 Page 7 of 12 Page ID #:77
`
`U.S. Patent
`
`Apr. 28, 2009
`
`Sheet 5 of 6
`
`US 7,524,087 Bl
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`120
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`FIG. 10
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`

`

`Case 2:17-cv-04263-JVS-JCG Document 1-4 Filed 06/08/17 Page 8 of 12 Page ID #:78
`
`U.S. Patent
`
`Apr. 28, 2009
`
`Sheet 6 of 6
`
`US 7,524,087 Bl
`
`250
`
`252 '
`
`254
`
`256 '
`
`260
`
`262
`
`264
`
`266
`
`270
`
`272
`
`274
`
`Form shape of lead frame plate by stamping
`
`' I
`
`Coat lead frame plate
`with conductive material
`
`Mold plastic housing on lead frame plate
`
`' I
`
`' I
`
`Cut leads from lead frame plate
`and bend leads to J shape
`
`'I
`
`Attach LED dies to lead frame
`
`' I
`
`Bond wires
`
`I I
`
`Encapsulate LED dies in housing cavities
`
`I I
`
`Cure encapsulant
`
`'I
`
`Perform electrical testing
`
`I I
`
`Taping
`
`I I
`
`Dry optical assembly for packing
`
`FIG. 11
`
`

`

`Case 2:17-cv-04263-JVS-JCG Document 1-4 Filed 06/08/17 Page 9 of 12 Page ID #:79
`
`US 7,524,087 Bl
`
`1
`OPTICAL DEVICE
`
`BACKGROUND
`
`5
`
`Large display panels such as stadium displays may consist
`of numerous small light emitting elements arranged in an
`array. A typical light emitting element consists of an LED die
`mounted in a plastic housing. However, many plastics used in
`LED housings are susceptible to moisture absorption from
`the environment which can cause the LED in the housing to 10
`fail.
`Some displays also include a plastic plate surrounding the
`light emitting elements to hide printed circuit boards and
`other components and to improve contrast. These plastic
`plates may impose minimum height requirements for light
`emitting elements so that they are not obscured by the plastic
`plate. These height requirements complicate the design of
`plastic housings for light emitting elements, either increasing
`the mass which increases susceptibility to moisture, or result(cid:173)
`ing in flimsy housings that are prone to cracking or other
`physical failures.
`
`2
`sources near a height of a top surface of the plastic plate, or
`placing the tops of the light sources high enough that a potting
`material leaves the tops of the light sources substantially
`uncovered.
`Referring now to FIGS. 1 through 6, an exemplary optical
`device 10 will be described in more detail. In this embodi(cid:173)
`ment, the optical device 10 comprises a plastic leaded chip
`carrier (PLCC) LED having six leads arranged along two
`sides of the PLCC housing. A top perspective view of the
`optical device 10 is shown in FIG. 1. One or more light
`sources such as LED dies 12, 14 and 16 are mounted in a
`reflector housing 20. The housing 20 has a top 22 (also
`referred to as a first end face) and a bottom 24 (FIG. 2) ( also
`referred to as a second end face) with a peripheral wall 26
`15 (also referred to as a sidewall) extending between the first end
`face 22 and second end face 24 and running around the sides
`of the housing 20. The LED dies 12, 14 and 16 are located in
`a first cavity 30 ( also referred to as a pocket) formed in the first
`end face 22 of the reflector housing 20. The LED dies 12, 14
`20 and 16 are mounted to an electrically conductive lead frame
`32, to be discussed in more detail below. A second cavity 34
`is formed on the second end face 24, reducing the overall
`mass of the housing 20 and thus reducing moisture absorp(cid:173)
`tion. The second cavity 34 is surrounded on four sides by the
`25 peripheral wall 26, providing rigidity and preventing cracks
`due to flexing.
`The cavity 30 in which the LED dies 12, 14 and 16 are
`located may have angled walls to focus and direct light from
`the LED dies 12, 14 and 16 away from the first end face 22 of
`30 the optical device 10. The cavity 30 may also have a polished
`surface or a reflective coating placed on the walls to further
`reflect light incident on the walls from the LED dies 12, 14
`and 16 into the desired direction away from the first end face
`22 of the optical device 10.
`The electrical connections for the optical device 10 are
`provided by the lead frame 32 which in the exemplary
`embodiment includes six leads 36, 40, 42, 44, 46 and 50.
`(Note that in FIG. 2, one lead 42 is omitted from the drawing
`to expose a lead receiving compartment 52 underneath the
`40 leads.) Each of the leads 36, 40, 42, 44, 46 and 50 are bent so
`that the exposed portion has a J shape enabling the optical
`device 10 to be mounted and soldered to a circuit board or
`other mounting surface using surface mount techniques such
`as reflow soldering. (Note that if the entire portion of the leads
`45 36, 40, 42, 44, 46 and 50 is considered, including the portion
`extending within the housing 20 and to which the LED dies
`12, 14 and 16 are connected, the leads 36, 40, 42, 44, 46 and
`50 have a U shape.) The forming of the leads 36, 40, 42, 44, 46
`and 50 in the lead frame 32 will be described in more detail
`below. In alternative embodiments, the leads 36, 40, 42, 44,
`46 and 50 may be formed in other configurations as desired.
`For example, the number ofleads may be altered to accom(cid:173)
`modate more or fewer light sources, or to combine connec(cid:173)
`tions as desired such as in a common cathode configuration in
`which each LED die 12, 14 and 16 has a cathode connected to
`a shared lead. The leads 36, 40, 42, 44, 46 and 50 may also be
`distributed around the housing 20 in other configurations as
`desired, such as with leads located on all four sides of a
`four-sided housing 20. The leads 36, 40, 42, 44, 46 and 50
`may also be configured to enable other connection mecha(cid:173)
`nisms, such as for through-hole connections using pins or
`cylindrical leads rather than surface mount connections using
`J shaped flat leads.
`Each of the leads 36, 40, 42, 44, 46 and 50 of the exemplary
`embodiment is located over a cavity or lead receiving com(cid:173)
`partment ( e.g., 52) formed in the exterior of the peripheral
`wall 26. The lead receiving compartments (e.g., 52) reduce
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`FIG. 1 is a top perspective view of an exemplary optical
`device.
`FIG. 2 is a bottom perspective view of an exemplary optical
`device.
`FIG. 3 is a top view of an exemplary optical device.
`FIG. 4 is a cross-sectional end view of the exemplary
`optical device of FIG. 3 taken along line 3-3.
`FIG. 5 is a side view of the exemplary optical device of
`FIG. 3.
`FIG. 6 is a bottom view of the exemplary optical device of
`FIG. 3.
`FIG. 7 is an exemplary portion of a lead frame plate cor-
`responding to a single optical device.
`FIG. 8 is an exemplary lead frame plate.
`FIG. 9 is an exemplary display.
`FIG. 10 is a side view of an exemplary display illustrating
`an exemplary plate or potting material surrounding optical
`devices in the display.
`FIG. 11 is a flowchart of an exemplary operation for form(cid:173)
`ing an optical assembly.
`
`DESCRIPTION
`
`35
`
`The drawings and description, in general, disclose an opti-
`cal device, display, and a method of forming an optical assem(cid:173)
`bly. In one exemplary optical device, one or more light 50
`sources such as light emitting diodes (LEDs) are mounted in
`a housing and may be encapsulated if desired for protection.
`The optical device and assembly may be taller than previous
`designs to meet needs of some large displays, while minimiz(cid:173)
`ing the mass and the moisture absorption of a housing. Fail- 55
`ures due to moisture absorption are thus minimized. The
`configuration of the housing also provides for high strength to
`minimize cracks or other mechanical failures.
`The exemplary display may include a number of optical
`devices, for example, mounted in a two dimensional array on 60
`a circuit board or other mounting surface. The optical devices
`may be surrounded by a plastic plate that either completely or
`partially surrounds one or more of the optical devices in the
`display. Alternatively, the mounting surface with optical
`devices may be coated in a potting material such as silicone 65
`potting. The height of the optical devices may be tall enough
`to avoid obscuring light output, for example, placing the light
`
`

`

`Case 2:17-cv-04263-JVS-JCG Document 1-4 Filed 06/08/17 Page 10 of 12 Page ID #:80
`
`US 7,524,087 Bl
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`4
`joint, or a combination of these or other connection tech(cid:173)
`niques. For example, the LED dies 12, 14 and 16 may also be
`held in place either partially or fully by the encapsulant 64.
`The LED dies 12, 14 and 16 may be electrically connected to
`the lead frame 32 either by one, two or more wire bonds
`between each LED die and an appropriate lead in the lead
`frame 32, or by a solder connection between a pad such as a
`PN junction on the LED die and a lead in the lead frame 32, or
`by a combination of these or other electrical connection tech(cid:173)
`niques.
`Dimensions of an exemplary embodiment illustrated in
`FIGS. 3-6 are contained in Table 1 below. The exemplary
`dimensions may lie within acceptable ranges or tolerances,
`may be scaled or adapted as desired and are not to be viewed
`as limiting. The dimensions contained in Table 1 are in mil(cid:173)
`limeters unless otherwise indicated.
`
`TABLE 1
`
`3
`the mass of the housing 20 and limiting inward deflection of
`the leads 36, 40, 42, 44, 46 and 50. In one exemplary embodi(cid:173)
`ment, the combined volume of the bottom cavity 34 and lead
`receiving compartments is at least about 50% of the volume of
`the top cavity 30. The lead receiving compartment may be J 5
`shaped to match the shape of the leads 36, 40, 42, 44, 46 and
`50, enabling the leads 36, 40, 42, 44, 46 and 50 to fit within
`and facilitating the bending of the leads 36, 40, 42, 44, 46 and
`50 into the desired J shape. Each of the cavities (e.g., 52)
`under the leads 36, 40, 42, 44, 46 and 50 is separated by ribs 10
`54, 56, 60 and 62 formed in the peripheral wall 26 of the
`housing 20. The ribs separate the leads 36, 40, 42, 44, 46 and
`50 and prevent short circuits, increase the strength of the
`housing 20, and prevent the leads 36, 40, 42, 44, 46 and 50
`from twisting, particularly while the leads 36, 40, 42, 44, 46 15
`and 50 are being bent into a J shape.
`The exemplary bottom cavity 34 is surrounded on all four
`sides by the peripheral wall 26, rather than just forming a slot
`and having the slot bounded by the peripheral wall 26 only on
`the two sides with leads. The fully bounded cavity 34 is 20
`stronger than a slot and prevents cracking during bending of
`the leads to form the J shape. The fully bounded cavity 34 also
`forms a stable platform for the optical device 10 so that it is
`less likely to tip over during the assembly and mounting
`proc~s.
`The cavity 30 formed in the first end face 22 of the reflector
`housing 20 may be filled with an encapsulant 64 (see FIG. 4)
`to cover and protect the LED dies 12, 14 and 16 if desired. For
`example, a substantially transparent silicone material may be
`used as an encapsulant 64. Any material that can be held 30
`within the cavity 30 and that substantially transmits light
`through itself may be used as the encapsulant 64, and particu(cid:173)
`larly materials that adhere uniformly within the cavity 30 and
`prevent moisture from reaching the LED dies 12, 14 and 16.
`The type, color and number of light sources placed within 35
`the cavity 30 of the reflector housing 20 in the optical device
`10 may be varied as desired. In one exemplary embodiment,
`a substantially white optical device 10 may be formed by
`including a red, a green and a blue LED die ( e.g., 12, 14 and
`16) that visually combine to form a white overall output from 40
`each individual optical device 10. Alternatively, an overall
`white light may be formed in a display using multiple optical
`devices that do not individually produce white light. For
`example, an optical device having one or more red light
`sources may be combined with a second optical device having 45
`one or more green light sources and a third optical device
`having one or more blue light sources. Each optical device 20
`may include a single light source, two light sources, or three
`light sources, etc. as desired. The placement of the light
`sources within the cavity 30 of the reflector housing 20 in the 50
`optical device 10 may also be varied as desired. For example,
`FIG. 1 illustrates an exemplary embodiment in which three
`LED dies 12, 14 and 16 are substantially aligned in a straight
`line. In an alternative embodiment, the light sources may be
`placed in other configurations as desired to meet various 55
`needs, such as increasing the perceived uniformity of an
`overall white light. For example, the LED dies 12, 14 and 16
`may be placed in a triangle. Multiple optical devices having
`different configurations oflight sources may also be variously
`arranged and combined together to increase the perceived 60
`uniformity of an overall light of a given color such as white.
`The LED dies 12, 14 and 16 or other light sources may be
`physically attached within the cavity 30 of the reflector hous(cid:173)
`ing 20 in the optical device 10 to the lead frame 32, the
`reflector housing 20 itself, or to another structure that holds 65
`the light sources in the desired location. The LED dies 12, 14
`and 16 may be physically attached using an adhesive, a solder
`
`~
`
`70
`72
`74
`76
`78
`80
`82
`84
`86
`88
`90
`91
`92
`94
`96
`98
`100
`102
`104
`106
`108
`110
`112
`114
`116
`
`4.4
`1.8
`3.7
`0.79
`0.83
`4
`4.4
`3.4
`3.08
`2.29
`42°
`0.2
`1.35
`2.16
`0.9
`2.4
`2.07
`1.85
`0.3
`1.45
`0.1
`0.65
`0.8
`0.3
`0.7
`
`Referring now to FIGS. 7 and 8, the exemplary formation
`ofleads in an optical device 10 will be described. A lead frame
`32 for a single optical device 10 may be formed in a lead
`frame plate 120, simplifying the creation of lead frames for
`multiple optical devices. The use of a lead frame 32 and lead
`frame plate 120 holds the individual leads in place while the
`reflective housing 20 is formed around the leads by molding
`or other suitable processes. The exemplary lead frame 32 with
`six leads 122, 124, 126, 130, 132 and 134 is illustrated in FIG.
`7. The shape and length of each lead 122, 124, 126, 130, 132
`and 134 may be configured as desired based on the placement
`of the LED dies 12, 14 and 16. Dimples or roughened areas
`136, 138 and 140 may be stamped or otherwise formed in the
`leads (e.g., 122, 126 and 132) to facilitate mounting and
`soldering the LED dies 12, 14 and 16. Holes (e.g., 142) may
`also be formed in the leads 122, 124, 126, 130, 132 and 134 if
`desired so that the plastic material in the reflective housing 20
`can pass through and fill the holes (e.g., 142) during the
`molding process to hold the leads 122, 124, 126, 130, 132 and
`134 in place within the optical device 10.
`The leads 122, 124, 126, 130, 132 and134 are formed in the
`lead frame 32 by stamping or cutting an opening 144 in the
`lead frame plate 120, leaving the leads 122, 124, 126, 130,
`132 and 134 defined by the opening 144. The leads 122, 124,
`126, 130, 132 and 134 are still held in place by the lead frame
`plate 120 so that the reflective housings ( e.g., 20) can be
`
`

`

`Case 2:17-cv-04263-JVS-JCG Document 1-4 Filed 06/08/17 Page 11 of 12 Page ID #:81
`
`US 7,524,087 Bl
`
`5
`molded over the leads on the lead frame plate 120. Thus,
`multiple reflective housings (e.g., 20) may be formed on a
`single lead frame plate 120. The leads 122, 124, 126, 130, 132
`and 134 can then later be cut away from the lead frame plate
`120, freeing each optical device ( e.g., 10) from the lead frame 5
`plate 120 and separating each lead ( e.g., 122) from the others
`(e.g., 124-134). One reflective housing 20 with LED dies is
`shown on the lead frame plate 120 of FIG. 8 to illustrate the
`placement of reflective housings on the lead frame plate 120.
`However, during actual fabrication, multiple reflective hous-
`ings may be formed simultaneously or otherwise on the lead
`frame plate 120 by injection molding or other suitable pro(cid:173)
`cesses. LED dies (e.g., 12, 14 and 16) or other light sources
`may be attached in the reflective housings (e.g., 20) either
`while the lead frames ( e.g., 32) remain connected to the lead 15
`frame plate 120 or after they have been cut away.
`Dimensions of an exemplary embodiment of a lead frame
`32 illustrated in FIG. 7 are contained in Table 2 below. Again,
`the exemplary dimensions may lie within acceptable ranges
`or tolerances, may be scaled or adapted as desired and are not 20
`to be viewed as limiting. The dimensions contained in Table
`2 are in millimeters unless otherwise indicated.
`
`10
`
`TABLE2
`
`164
`166
`196
`
`0.8
`0.65
`10.2
`
`25
`
`An exemplary display 200 including an array of optical 30
`devices (e.g., 10) is illustrated in FIG. 9. For example, large
`stadium displays may be formed by a two dimensional array
`of optical devices (e.g., 10) as described above. Any spaces
`between the optical devices (e.g., 10) may filled by a plate or
`potting material 202 or other suitable materials. For example, 35
`the optical devices (e.g., 10) may be at least partially sur(cid:173)
`rounded and separated by a plate 202 made of any suitable
`material such as plastic or metal. The plate 202 may have a
`dark or black coating if desired to increase the black level and
`apparent contrast of the display 200. Alternatively, a potting 40
`material 202 may be used to fill the spaces between the optical
`devices ( e.g., 10), for example, a silicone potting material. As
`with the plate, the silicone potting material may have a dark or
`black coating if desired to increase the black level and appar(cid:173)
`ent contrast of the display 200. The plate or potting material 45
`202 may be used to fill spaces left by the manufacturing
`process in which the optical devices (e.g., 10) are connected
`to a mounting surface such as a circuit board, and may also act
`to protect the mounting surface and optical devices (e.g., 10)
`from moisture or other environmental hazards. A side view of 50
`an exemplary display 200 is shown in FIG. 10, in which
`optical devices (e.g., 10) are mounted to a circuit board or
`other mounting surface 204 and surrounded by a plate or
`potting material 202.
`An exemplary method of forming an optical assembly is 55
`s=arized
`in the flow chart of FIG. 11. A lead frame plate is
`formed 250 by cutting or stamping the shape into a copper
`sheet or other suitable material. The lead frame plate may be
`coated 252 with another conductive material such as silver if
`desired to enhance conductivity though connections to the 60
`leads. One or more plastic housings may be formed 254 on the
`lead frame plate, such as by injection molding. The plastic
`housings may be formed using any suitable material, such as
`polyphthalamide. The leads are cut 256 from the lead frame
`plate and bent into a J shape or otherwise formed into any 65
`desired shape. Light sources such as LED dies are attached
`260 to each lead frame, and wires are bonded 262 as needed
`
`6
`to the LED dies to electrically connect the LED dies to the
`lead frame. The LED dies may be encapsulated 264 in the
`housing cavities, such as with a substantially transparent sili(cid:173)
`cone material, and the encapsulant may be cured 266 if
`needed. The optical devices 10 may be electrically tested 270,
`taping 272 and any other finishing steps may be performed,
`and the optical devices 10 may be dried 274 for packing.
`The optical device, display, and a method of forming an
`optical assembly described herein provides a reliable source
`oflight while reducing the mass of the housing and the sus(cid:173)
`ceptibility to moisture absorption. The optical device housing
`may be made relatively tall if desired to meet the design
`specifications for a display, thus avoiding obscuring the light
`sources by plates or potting materials used to surround the
`optical devices in the display.
`While illustrative embodiments have been described in
`detail herein, it is to be understood that the concepts disclosed
`herein may be otherwise variously embodied and employed,
`and that the appended claims are intended to be construed to
`include such variations, except as limited by the prior art.
`What is claimed is:
`1. An optical device comprising:
`a lead frame with a plurality of leads;
`a reflector housing formed around the lead frame, the
`reflector housing having a first end face and a second end
`face and a peripheral sidewall extending between the
`first end face and the second end face, the reflector
`housing having a first pocket with a pocket opening in
`the first end face and a second pocket with a pocket
`opening in the second end face;
`at least one LED die mounted in the first pocket of the
`reflector housing;
`a light transmitting encapsulant disposed in the first pocket
`and encapsulating the at least one LED die; and
`wherein a plurality of lead receiving compartments are
`formed in the peripheral sidewall of the reflector hous(cid:173)
`ing.
`2. The optical device of claim 1, wherein the combined
`volume of the second pocket and the lead receiving compart(cid:173)
`ments is at least 50% of the volume of the first pocket.
`3. The optical device of claim 2, said plurality of leads
`being J-shaped.
`4. The optical device of claim 2, said plurality of leads
`comprising six leads in two rows.
`5. The optical device of claim 2, said plurality of lead
`receiving compartments being J-shaped.
`6. The optical device of claim 1, wherein the plurality of
`lead receiving compartments define a plurality of ribs dis(cid:173)
`posed between the plurality oflead receiving compartments.
`7. The optical device of claim 1, said at least one LED die
`comprising three LED dies.
`8. The optical device of claim 7, said three LED dies
`comprising at least two colors.
`9. A display comprising a plurality of plastic leaded chip
`carrier LEDs, the plastic leaded chip carrier LEDs each com(cid:173)
`prising:
`a lead frame with a plurality of leads;
`a reflector housing formed around the lead frame, the
`reflector housing having a first end face and a second end
`face and a peripheral sidewall extending between the
`first end face and the second end face, the reflector
`housing having a cavity in the first end face, said periph(cid:173)
`eral sidewall having a plurality of lead receiving com(cid:173)
`partments formed therein;
`at least one LED die mounted in the cavity of the reflector
`housing; and
`
`

`

`Case 2:17-cv-04263-JVS-JCG Document 1-4 Filed 06/08/17 Page 12 of 12 Page ID #:82
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`US 7,524,087 Bl
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`7
`a light transmitting encapsulant disposed in the cavity and
`encapsulating the at least one LED die.
`10. The display of claim 9, said reflector housing further
`comprising a second cavity in the second end face.
`11. The display of claim 10, wherein the plurality of lead 5
`receiving compartments define a plurality of ribs disposed
`between the plurality of lead receiving compartments.
`12. The display of claim 11, said plurality of leads being
`J-shaped.
`13. The display of claim 9, wherein said lead receiving 10
`compartments limit inward deflection of said plurality of
`leads.
`14. The display of claim 9, wherein said display comprises
`a stadium display.
`15. An illumination system, comprising:
`a reflector housing molded on a lead frame having a plu(cid:173)
`rality of electrically conductive leads, the reflector hous(cid:173)
`ing having a first cavity and a second cavity on opposite
`sides of the reflector housing;
`at least one LED die mounted in said first cavity and elec(cid:173)
`trically connected to said plurality of electrically con(cid:173)
`ductive leads; and
`
`8
`said reflector housing further having a first end face and a
`second end face and a peripheral sidewall extending
`between the first end face and the second end face, the
`reflector housing having a cavity in the first end face,
`said peripheral sidewall having a plurality ofleadreceiv(cid:173)
`ing compartments formed therein.
`16. The illumination system of claim 15, wherein said
`plurality of electrically conductive leads have a J-shape.
`17. The illumination system of claim 15, further compris(cid:173)
`ing an encapsulant filling said first cavity around said at least
`one LED die.
`18. The illumination system of claim 15, further compris(cid:173)
`ing a plurality of other reflector housings each having at least
`15 one LED die mounted, said reflector housing and said plural(cid:173)
`ity of other reflector housings arranged in an array in a dis(cid:173)
`play.
`19. The illumination system of claim 18, said display com-
`20 prising a stadium display.
`
`* * * * *
`
`