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Displaying 69-83 of
88 results
L8CCQAO8GREENX4
Document
DOMINO SCAN ARCHITECTURE AND DOMINO SCAN FLIP-FLOP FOR THE TESTING OF DOMINO AND HYBRID CMOS CIRCUITS, 08/947,271, No. L8CCQAO8GREENX4 (U.S. Pat. App. Apr. 1...
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L26LQQBFGREENX4
Document
PROCESS OF FABRICATING AN INTERGRATED CIRCIUIT DIE PACKAGE HAVING A PLURALITY OF PINS, 08/916,025, No. L26LQQBFGREENX4 (U.S. Pat. App. Apr. 15, 2022)
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1-11-US-1641150809P1
Document
DIALYSIS PRESCRIPTION OPTIMIZATION FOR DECREASED ARRHYTHMIAS, 16/411,508, No. 1-11-US-1641150809P1 (U.S. Pat. App. Feb. 12, 2020)
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L26UHK2QGREENX5
Document
CORDLESS TELEPHONE WITH MP3 PLAYER CAPABILITY, 09/447,284, No. L26UHK2QGREENX5 (U.S. Pat. App. Apr. 15, 2022)
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22-15-US-160492960OP1
Document
System and Method for Determining Vehicle Occupancy for Enforced Areas, 16/49,296, No. 22-15-US-160492960OP1 (U.S. Pat. App. Oct. 28, 2020)
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No. 686202-7
Document
Certain Semiconductor Devices, Products Containing the Same, and Components Thereof (I), 337-1176, No. 686202-7 (U.S.I.T.C. Aug. 26, 2019)
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Petition for Review
Document
C.H. v. THE STATE OF TEXAS, 13-0874, Petition for Review (Texas Oct. 30, 2013)
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Redrafted Petition for Review
Document
C.H. v. THE STATE OF TEXAS, 13-0874, Redrafted Petition for Review (Texas Feb. 6, 2014)
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Case No. GD-03-017448
Document
Gnarra vs Allied Glove Corporation etal, GD-03-017448, None (Pennsylvania State, Court of Common Pleas, Allegheny County, Civil Division Nov. 12, 2004)
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297-83-US-163488111DP1
Document
METHOD AND SYSTEM FOR TREATING BIOMASS, 16/348,811, No. 297-83-US-163488111DP1 (U.S. Pat. App. Apr. 26, 2021)
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K1G8GRRHRXEAPX3
Document
SEMICONDUCTOR DEVICE PACKAGE INCLUDING A SUBSTRATE HAVING BONDING FINGERS WITHIN AN ELECTRICALLY CONDUCTIVE RING SURROUNDING A DIE AREA AND A COMBIN...
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1-104-US-112769380AP1
Document
DEVICE FOR MINIMIZING DIFFERENTIAL PAIR LENGTH MISMATCH AND IMPEDANCE DISCONTINUITIES IN AN INTEGRATED CIRCUIT PACKAGE DESIGN, 11/276,938, No. 1-104-US-11276...
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1-104-US-113792561IP1
Document
METHOD FOR ELECTRICAL INTERCONNECTION BETWEEN PRINTED WIRING BOARD LAYERS USING THROUGH HOLES WITH SOLID CORE CONDUCTIVE MATERIAL, 11/379,256, No. 1-10...
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1-104-US-114034920JP1
Document
METHOD AND APPARATUS FOR IMPROVING THERMAL ENERGY DISSIPATION IN A DIRECT-CHIP-ATTACH COUPLING CONFIGURATION OF AN INTEGRATED CIRCUIT AND A CIRCUIT BO...
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1-104-US-115625370QP1
Document
INTEGRATED CIRCUIT CHIP ASSEMBLY HAVING ARRAY OF THERMALLY CONDUCTIVE FEATURES ARRANGED IN APERTURE OF CIRCUIT SUBSTRATE, 11/562,537, No. 1-104-US-115625...
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