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`a2) United States Patent
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`(10) Patent No.:
`US 7,852,184 B2
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`Yamazakiet al.
`Dec. 14, 2010
`(45) Date of Patent:
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`US007852184B2
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`(75)
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`(54) COIL MODULE APPARATUS
`;
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`Inventors: Manabu Yamazaki, Kanagawa(JP);
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`Kuniharu Suzuki, Tokyo (JP); Katsuya
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`Suzuki, Gunma (JP); Hiroshi Kato,
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`Kanagawa (JP); Yoichire Kondo,
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`Nagano (JP); Keta Onishi, Aichi (JP);
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`Kentaro Yoda, Nagano (IP); Mikimoto
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`Jin, Nagano (JP)
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`(73) Assignees: Sony Ericsson Mobile
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`Communications Japan, Inc., Tokyo
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`(JP); Seiko Epson Corporation, Tokyo
`)
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`GP)
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`(*) Notice:
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`Subject to any disclaimer, the term ofthis
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`patent is extended or adjusted under 35
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`U.S.C. 154(b) by 99 days.
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`(21) Appl No.: 12/153.935
`— ,
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`May28, 2008
`Filed:
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`Prior Publication Data
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`Dee. 4, 2008
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`US 2008/0297295 Al
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`(22)
`(65)
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`(30)
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`(IP)
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`Foreign Application Priority Data
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`vssesseeseeseesetsenseeseeee 2007-141690
`(
`)
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`May 29,2007
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`(1)
`Int. Cl.
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`2006.01
`HOLF 38/12
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`(52) US. CD. ccc ccceseeeseeseereescseees 336/84 M
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`(58) Field of Classification Search ................... 336/65,
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`336/83, 84 R, 84 M, 84 C, 200, 232; 320/108
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`See application file for complete search history.
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`(56)
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`References Cited
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`U.S. PATENT DOCUMENTS
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`5,375,040 A * 12/1994 Cooperetal... 361/730
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`6,473,304 B1* 10/2002 Stevens 0... cece 361/704
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`6,636,140 B2* 10/2003 Fujiyoshiet al.
`............ 336/200
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`7,495,414 B2*
`2/2009 Hui sees enetenconceeceanensees 320/108
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`7,545,336 B2*
`6/2009 Naito ..cccceeesesecccerees 343/788
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`2008/0197957 Al*
`8/2008 Kondo etal. ......... 0. 336/90
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`FOREIGN PATENT DOCUMENTS
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`JP
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`2006-339329
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`12/2006
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`* cited by examiner
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`Primary Examiner—Tuyen Nguyen
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`(74) Attorney, Agent, or Firm—Rader, Fishman & Grauer
`
`PLLC
`(57)
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`ABSTRACT
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`Acoil module apparatus is provided. The coil module appa-
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`ratus includes a flat coil, a circuit board, a magnetic sheet,
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`connection terminals, anda case. Theflat coil hasa flat shape.
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`Thecircuit boardis used forthe flat coil. The magnetic sheet
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`is provided so as to cover one surface portion of the flat coil.
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`The connection terminals are provided for connectingtheflat
`coil and the circuit board. The case enclosestheflat coil, the
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`circuit board, and the magnetic sheet and encloses the con-
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`nection terminals so that the connection terminals are partly
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`exposed.
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`17 Claims, 16 Drawing Sheets
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`Page 1 of 23
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`GOOGLEEXHIBIT 1009
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`GOOGLE EXHIBIT 1009
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`U.S. Patent
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`Dec. 14, 2010
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`Sheet 1 of 16
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`US 7,852,184 B2
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`FIG.1
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`U.S. Patent
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`Sheet 2 of 16
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`US 7,852,184 B2
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`FIG. 2
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`Page 3 of 23
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`Sheet 4 of 16
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`US 7,852,184 B2
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`WOVdAYALIVE
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`IgYOWdAULIVE29G250
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`eSG9OfV9Old
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`eS
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`pSLS
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`LINAAVIdSIdLINNAVIdS1
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`LINANOTLVY3d0>>
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`WOVdAYALIVE
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`NOILYOdJ10H
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`LNAWHOVLLY
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`LINANOILYY3d0
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`Sheet 5 of 16
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`US 7,852,184 B2
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`=L
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`D
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`Lo
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`FIG.7
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`Sheet6 of 16
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`US 7,852,184 B2
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`FIG. 8
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`Page 7 of 23
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`U.S. Patent
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`Dec. 14, 2010
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`Sheet 7 of 16
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`US 7,852,184 B2
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`09
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`MOWdAYALLVE
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`LINNNOILVY3d0>
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`MOVdAYALLVE
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`NOTLYOd310H
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`INSWHOVILY
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`LINANOILVY3d0
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`r}YOVdANSLLVE
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`[96G
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`vsIS
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`G6O17
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`V6Il4
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`Sheet 8 of 16
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` FIG. 10A
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`3
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`FIG. 10B
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`1 (54)
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`1 (64)
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`Sheet 9 of 16
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`FIG. TTA
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`—
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`isLowt
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`-o
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`14)
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`s(Etccewomenweeenecnnia‘‘‘¢
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`worwen
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`Sheet 10 of 16
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`US 7,852,184 B2
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`fm
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`aower
`-~_
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`t1'11‘ii‘4i''t1!1'1‘'4Ji14‘1'‘i‘(i!''11ai'‘4!‘'‘'i}i‘
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`Sheet11 of 16
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`1 (2, 54)
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`FIG. 13B
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`FIG. 13A
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`Sheet 12 of 16
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`US 7,852,184 B2
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`1 (2, 54)
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`5
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`FIG. 14A
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`Sheet 13 of 16
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`US 7,852,184 B2
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`1 (2, 54)
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`FIG. 15B
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`FIG. 15A
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`Sheet 14 of 16
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`US 7,852,184 B2
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`FIG. 16
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`1058
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`SURFACE PORTION FORMED OF
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`FIG. 17
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`RESIN
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`RESIN MIXED WITH MAGNETIC MATERIAL
`1 (54)
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`RESIN MIXED WITH
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`MAGNETIC MATERIAL
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`Sheet 15 of 16
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`FIG. 18
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`RESIN
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`RESIN MIXED WITH
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`1 (54)
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`FIG. 19
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`RESIN MIXED WITH
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`MAGNETIC MATERIAL
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`51
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`9
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`RESIN
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`RESIN MIXED WITH
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`MAGNETIC MATERIAL
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`ELASTIC RESIN
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`(ABSORBS EXPANSION OF BATTERY PACK)
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` BATTERY PACK
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`1
`COIL MODULE APPARATUS
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`US 7,852,184 B2
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`of the flat coil. In addition, by assemblingthe flat coil into a
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`module, theflat coil can be incorporated in a charged appli-
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`ance in a simplified manner.
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`According to an embodiment ofthe invention, sincetheflat
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`coil andthe like are incorporated in a case and therefore the
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`resistance to bending and the strength of the flat coil can be
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`obtained. Also, since the flat coil is assembled into a module,
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`the flat coil can be incorporated in a charged appliance in a
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`simplified manner.
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` BRILI DESCRIPTION OL TIE DRAWINGS
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`CROSS REFERENCES TO RELATED
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`APPLICATIONS
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`The present invention contains subject matter related to
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`Japanese Patent Application JP 2007-141690 filed in the
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`Japanese Patent Office on May 29, 2007, the entire contents of
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`which being incorporated herein by reference.
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`BACKGROUND OF THE INVENTION
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`a
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`SUMMARYOP THE INVENTION
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`FIG. 1 is an exploded perspective view of a coil module
`1. Field of the Invention
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`apparatus according to a first embodiment of the present
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`‘The present invention relates to a coil module apparatus
`invention.
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`suitably applied to a contactless powertransferring coil that
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`FIG. 2 is a perspective view of a coil module apparatus
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`carries out contactless charging of a charged appliance such
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`according to the first embodimentof the present invention.
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`as a mobile phone unit, a PITS (Personal [landyphone Sys-
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`FIG. 3 is a viewused for explainingaflat coil formed using
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`tem) telephone, a PDA (Personal Digital Assistant), a mobile
`a wire.
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`gamedevice, a digital camera apparatus, a notebook personal
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`FIG. 4 is an exploded perspective view ofa flat coil with a
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`computer or the like. In particular, the present invention
`multilayer structure formed by stackinga plurality of flexible
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`relates to a coil module apparatus which, by assemblinga flat
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`printed circuit boards on which conductive patterns are
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`formed.
`coil that has been madeslim into a module, has improved
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`resistance to bending and improvedstrength and canbe easily
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`FIG. 5 is a view used for explaining the connections
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`installed in a charged appliance.
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`between the conductive patterns ofa flat coil having a multi-
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`2. Description of the Related Art
`layer structure.
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`Japanese Unexamined Patent Application Publication No.
`FIGS. 6A and 6B are viewsusedfor explaining a process of
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`2006-339329 discloses a flat coil apparatus for contactless
`attaching the coil module apparatus according to the first
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`powertransferring so as to obtainasufficientlyslim apparatus embodimentofthe present invention to a mobile phoneunit.
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`(see pages 7 to 8 and FIG. 1). With this flat coil apparatus, a
`FIG. 7 is an exploded perspective view of a coil module
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`spiral coil is formedso as to be disposed onacircuit board and apparatus according to a second embodimentofthe present
`a so-called return conductor formed in a direction that
`invention.
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`traversesthe coil in the radial direction fromthe centerto the
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`FIG. 8 is a perspective viewof the coil module apparatus
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`outer periphery is formed by a printed circuit on the circuit
`according to the second embodiment.
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`board. By using a printed circuit as the return conductor,it is
`FIGS. 9A and 9Bare viewsusedfor explaining a process of
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`possible to minimize the thicknessofthe flat coil apparatus,
`attaching the coil module apparatus according to the second
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`and to makethe entire flat coil apparatus sufficiently slim.
`embodimentof the present invention to a mobile phone unit.
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`FIGS. 10A and 10B are views used for explaining a first
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`modification where a groove portioninto whichtheflat coil is
`fitted is formed in a case.
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`FIGS. 11A and 11Bare viewsusedfor explaining a second
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`However, whenusing a slim coil such as oneintheflat coil
`modification where the flat coil is insert molded inside the
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`apparatus disclosed in Japanese Unexamined Patent Applica-
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`tion Publication No. 2006-33 9329,resistance to bending and
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`FIGS. 12A and 12Bare views used for explaining a third
`strength for the flat coil apparatus may be reduced.
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`modification where a magnetic sheet and/or metal sheet are
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`Further, in the flat coil apparatus disclosed in Japanese
`insert molded inside the case.
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`Unexamined Patent Application Publication No. 2006-
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`FIGS. 13A and 13B are viewsused for explaining a fourth
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`339329,the flat coil itself remains exposed. Accordingly, the
`modification where the circuit board is insert molded inside
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`process of incorporating the flat coil apparatus into a charged
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`appliance such as a mobile appliance may be complicated.
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`FIGS. 14A and 14B are views used for explaininga fifth
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`It is desirable to provide a coil module apparatus capable of
`modification where a temperature sensor is insert molded
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`insidethe case.
`maintaining the resistance to bending and the strength of a
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`coil that has been madeslimand of being easily incorporated
`[IGS. 15A and 15B are views used for explaining a sixth
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`in an appliance.
`modification where a temperature sensor is provided between
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`According to an embodiment of the invention, there is
`any two layers of a multilayer circuit board and the multilayer
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`provided a coil module apparatus. The coil module apparatus
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`moldedinside the case.
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`includes: a flat coil havingaflat shape; a circuit board for the
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`flat coil; a magnetic sheet provided so as to cover one surface
`FIG. 16 is a view used for explaining a seventh modifica-
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`portion ofthe flat coil; connection terminals for connecting
`tion where a surface portion ofthe case is formed of a resinin
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`the flat coil and the circuit board; and a casc that encloses the
`which a magnetic material is mixed.
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`flat coil,
`the circuit board, and the magnetic sheet and
`FIG. 17 is a view used for explaining an eighth modifica-
`encloses the connection terminalsso that the connection ter-
`tion where the case is dual-molded of a resin in which a
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`minals are partly exposed.
`magnetic material is mixed and a normalresin.
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`According to an embodimentofthe invention, the flat coil
`FIG. 18 is a view used for explaining a ninth modification
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`is assembled into a module by enclosingthe flat coil and the
`wherethe case is dual-molded ofa resin in which a magnetic
`material is mixed and a normal resin and where a metal sheet
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`like inside a case. By enclosingtheflat coil inside the case,it
`is insert molded.
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`is possible to obtain the resistance to bending andthestrength
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`Page 18 of 23
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`

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`US 7,852,184 B2
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`FIG. 19 is a view used for explaining a tenth modification
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`where the case is dual-molded with a resin in which a map-
`netic material is mixed and a normal resin and where the
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`secondary side transfer coil 3 is insert molded.
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`FIG. 20 is a view used for explaining an eleventh modifi-
`cation where the case is formedofelastic resin.
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`DESCRIPTION OF THE PREFERRED
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`EMBODIMENTS
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`Embodiments of the present invention can be applied to a
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`coil module apparatus that realizes a contactless charging
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`function whenincorporated in a mobile phoneunit.
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`FirstEmbodiment
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`a
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`Construction of the Secondary Side Transfer Coil
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`As shownin FIG. 3, the secondary side transfer coil 3 is
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`formedbystickinga flat coil, which ts produced by winding
`a wire 20 such as a solid wire or stranded wire with an
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`insulating layer formed onthe surface thereofinto a spiral on
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`a substantiallyflat plane, via an adhesive sheet onto a flexible
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`printed. circuit board 21.
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`The flexible printed circuit board 21 is an extremely thin
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`sheet-like circuit board made of a material such as polyimide
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`resin andhas a surface insulating layer formedthereon. The
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`surface insulating layer is formed on the surface excluding a
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`first coil connecting portion 23, a second coil connecting
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`portion 25, and a first external connection terminalportion 26,
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`and a second external connection terminal portion 27. The
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`first coil connecting portion 23 is located inside an inner
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`peripheryportion 22 ofthe flat coil whenthe flat coil has been
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`stuckto the flexible printed circuit board 21. The second coil
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`connecting portion 25 is located in a periphery outside an
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`outerperipheryportion 24 ofthe flat coil when theflat coil has
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`been stuck to the flexible printed circuit board 21.
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`Thefirst coil connecting portion 23 andthefirst external
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`connection terminal portion 26are electrically connected via
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`a first internal wiring pattern 28 formed under the surface
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`insulating layer. Similarly, the second coil connecting portion
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`25 and the second external connection terminalportion 27 are
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`electrically connected via a second internal wiring pattern 29
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`formed underthe surface insulating layer.
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`Whenthe flat coil is stuck onto the flexible printed circuit
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`board 21, a windingstart portion in the inner periphery por-
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`tion 22 is electrically connected to the first coil connecting
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`portion 23 and a winding end portion of the outer periphery
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`portion 24 is clectrically connected to the second coil con-
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`necting portion 25. With this construction, the secondaryside
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`transfer coil 3 has no parts where the wire 20 overlaps itself,
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`so that the thickness of the secondary side transfer coil 3 can
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`be made extremely thin.
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`The magnetic sheet 7 and the metal sheet9 are stuck via the
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`double-sided tape sheet 6 and the double-sided tape sheet 8
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`respectively on the opposite surface of the secondary side
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`transfer coil 3 to the surface onthefirst case piece 1-side. The
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`magnetic sheet 7 and the metal sheet 9 are provided to effi-
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`ciently form magnetic paths for the secondary side transfer
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`coil 3 to increase the magnetic flux during contactless charg-
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`ing and also suppress unnecessary radiation due to magnetic
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`fields produced during contactless charging.
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`Alternative Construction of the Secondary-Side Transfer
`Coil
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`As shownin FIG.4, a flat coil with a multilayer structure
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`formed by stacking a plurality of flexible printed circuit
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`boards on whichflat coil patterns made of spiral conductive
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`pattems have been formed maybeusedas the secondaryside
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`transfer coil 3 other than a flat coil formedusing the wire 20
`as shownin FIG.3.
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`In this case, the secondary side transfer coil 3 includes a
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`four-layer structure. For example,a first layer circuit board
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`31, a secondlayercircuit board 32, a third layer circuit board
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`33, and a fourth layer circuit board 34 are respectively formed
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`of wiring conductive patterns 35 that have been wound in
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`spirals on sheet-like circuit boards of a material such as poly-
`imideresin.
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`A surface insulating layer 36 is formed on a surface of the
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`first layer circuit board 31 as a topmost layer, and an adhesive
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`layer and an insulating interlayer are formed in between the
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`first layer circuit board 31 and the secondlayercircuit board
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`32. In the same way, an adhesive layer and an insulating
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`interlayer are formed in between the second layer circuit
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`board 32 andthe third layer circuit board 33 and an adhesive
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`Construction of Coil Module Apparatus
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`FIG. 1 is an exploded perspective viewof a coil module
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`apparatus according, to a first embodiment of the present
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`invention and FIG.2 is a perspective viewof the cail module
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`apparatus according to the first embodiment after assembly.
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`As can be understood from FIG.1 and FIG.2, the coil module
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`apparatus according, to the present embodiment includes a
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`first case piece 1, a second case piece 2 and a secondaryside
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`transfer coil 3. The first case piece 1 and secand case piece 2
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`are formed ofABS(Acrylonitrile Butadiene Styrene copoly-
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`mer) resin or the like and form an internal enclosure when
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`placed facing one another and connected to one another. The
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`secondary side transfer coil 3 has a flat shape and charges a
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`battery pack ofthe mobile phone unit based on transfer power
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`transferred from a primary side transfer coil of a cradle appa-
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`ratus during contactless charging.
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`The coil module apparatusfurther includesa circuit board
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`4, a temperature sensor 5, a double-sided tape sheet 6, anda
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`magnetic sheet 7. The circuit board 4 carries out charging
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`control during contactless charging, control over the trans-
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`mission and reception of predetermined data, and. the like.
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`The temperature sensor 5 detects the temperature of the sec-
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`ondary side transfer coil 3 during, contactless charging. The
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`double-sided tape sheet 6 is provided so as to cover the
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`secondary side transfer coil 3 from the opposite side to the
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`first case piece 1. The magnetic sheet 7 is stuck onto the
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`secondary side transfer coil 3 via the double-sidedtape sheet
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`6 so as to cover the secondary side transfer coil 3.
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`The coil module apparatus further includes a double-sided
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`tape sheet 8 and a metal sheet 9. The double-sided tape sheet
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`8 is stuck onto the magnetic sheet 7. The metal sheet 9 is stuck
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`onto the secondary side transfer coil 3 via the double-sided
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`tape sheet 8 and the magnetic sheet 7 so as to cover the
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`secondary side transfer coil 3. That is, the magnetic sheet 7
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`and the metal sheet 9 are stuck in that order on the secondary
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`side transfer coil 3 via the double-sided tape sheet 6 and the
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`double-sided tape sheet 8, respectively.
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`Connection terminals 10 are provided on the second case
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`piece 2 and whenthe coil module apparatus is attached to the
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`mobile phoneunit, the connection terminals 10 are connected
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`to connection terminals provided on the mobile phoneunit for
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`the electrical continuity of the secondary side transfer coil 3,
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`the circuit board 4, and the temperature sensor5.
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`Thefirst case piece 1 and the second case piece 2 are placed
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`facing one another and connected to one another with the
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`components from the secondary side transfer coil 3 to the
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`metal sheet 9 enclosed therein and by doing so, a rectangular
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`box-shaped coil module apparatus as shown in FIG. 2 is
`formed.
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`ie)°°
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`Page 19 of 23
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`Page 19 of 23
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`5
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`layer and aninsulating interlayer are formed in between the
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`third layer circuit board 33 and the fourthlayer circuit board
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`34. The magnetic sheet 7 and the metal sheet 9 are stuck onto
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`the rear surface of the fourth layer circuit board 34 that is the
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`bottommost layer via an adhesive layer and an insulating
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`As shown in FIG. 5, pattern ends of inner periphery por-
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`tions 37 of conductive patterns 35 on thefirst layer circuit
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`board 31 to the fourth layer circuit board 34 are electrically
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`connectedviafirst through-holes 38. Similarly, pattern ends
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`of outer periphery portions 39 of the conductive patterns 35
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`on the first layer circuit board 31 to the fourth layer circuit
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`board 34 are electrically connected via second through-holes
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`In addition, the first through-holes 38 onthe inner periph-
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`ery portion 37 side ofthe conductive patterns 35 on each layer
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`are electrically connected to third through-holes 41 provided
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`on the outer periphery portion 39 side of the conductive
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`patterns 35 on eachlayer.
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`Also, the second through-holes 40 of the fourth layercir-
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`cuit board 34, for example, are electrically connected via a
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`second internal conductive pattern 42 to a second external
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`connecting terminal portion 44. Similarly, the first through-
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`holes 38 of the fourth layer circuit board 34 areelectrically
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`connected via the third through-holes 41 anda first internal
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`conductive pattern 43 to a first external connecting terminal
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`portion 45.
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`Whena flat coil with a multilayer structure is used as the
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`secondary side transfer coil 3, the flat coil is formed bythe
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`conductive patterns 35 ofthe flexible printed circuit boards 31
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`to 34 on each layer, and therefore the thickness can be made
`even slimmerthan theflat coil that uses the wire 20 described
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`earlier.
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`Attachmentof the Coil Module Apparatus
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`FIG.6A is a cross-sectional viewof a mobile phone unit in
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`which a coil module apparatus 50 is installed. As one
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`example, the mobile phone unit is a stick-shaped mobile
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`phone unit and includes a battery pack attachmenthole por-
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`tion 52 that encloses a battery pack 51 on a rear surface of an
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`operation unit and a coil module hole portion 53 that encloses
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`the coil module apparatus 50 on a rear surface of a display
`unit.
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`Whenattaching the coil module apparatus 50 to such a
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`mobile phoneunit, a rear cover 54 ofthe mobile phone unit is
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`removed. Subsequently, before the battery pack 51 is
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`attached, the coil module apparatus 50 is inserted into the coil
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`module hole portion 53 provided on the rear of the display
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`unit as shownby the dotted arrowin FIG. 6A. By doingso,the
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`connection terminals 10 provided on the coil module appara-
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`tus 50 and connection terminals provided on the mobile
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`phoneunit are in contact and electrically connected.
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`Next, the battery pack 51 is attached to the battery pack
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`attachment hole portion 52 of the mobile phone unit and then
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`the rear cover 54 is attached. By doing so, as shown in FIG.
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`6B, the coil module apparatus 50 is attachedinside the mobile
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`Note that the coil module apparatus 50 is attached to the
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`rear surface of the display unit in this example. However, an
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`insertion hole portion for the coil module apparatus 50 may
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`instead be provided on a base surface portion 55 ofthe mobile
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`terminal shownin FIG. 6A. Accordingly, by inserting the coil
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`module apparatus 50 via this insertion hole portion, the coil
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`module apparatus 50 can be attached between the battery
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`pack 51 and the rear cover 54. Alternatively, the insertion hole
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`portion ofthe coil module apparatus 50 maybe provided ona
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`side surface portion of the mobile phone unit and the coil
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`a
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`10
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`ie)°°
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`30
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`50
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`55
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`60
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`Page 20 of 23
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`US 7,852,184 B2
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`6
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`module apparatus 50 may be attached via the insertion hole
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`portion from the side surface portion of the mobile phone
`unit.
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`Effect of the FirstEmbodiment
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`As is clear from the above description, in the coil module
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`apparatus according to the first embodiment, the first case
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`piece 1 and the second case piece 2 are placed facing one
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`another and connected with the components fromthe second-
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`ary side transfer coil 3 to the metal sheet 9 enclosed thereinto
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`assemble a flat coil into a module. By doing so, the resistance
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`to bending andthe strength ofa flat coil that has been made
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`slim can be obtained with the first case piece 1 and the second
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`casepiece2. Since theflat coil is provided as a module, when
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`attached to a mobile phone unit, the coil module apparatus
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`may only needto be inserted inside the mobile phoneunit, so
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`that the flat coil is incorporated in a simplified manner.
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`Accordingly, the ease and productivity of the incorporating
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`process can be improved.
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`Also, since a processthat inserts the coil module apparatus
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`into a charged appliance such as a mobile phone unit is
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`sufficient as the incorporating process,it is possible to easily
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`provide a contactless charging function to only charged appli-
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`ances that may actually require such contactless charging
`function.
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`Second Embodiment
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`The first case piece 1 and the second case piece 2 are
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`formedso as to enclose the components from the secondary
`side transfer coil 3 to the metal sheet 9 in the coil module
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`apparatus according to the first embodiment. In contrast, a
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`coil module apparatus according to a second embodimentis
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`formed using a rear cover of a charged appliance, such as a
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`mobile phone unit, as thefirst case piece 1 described above.
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`Note that parts of the coil module apparatus according to
`the second embodiment that are the sameasthosein the coil
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`module apparatus according to the first embodiment
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`described earlier have been assigned the same reference
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`numerals in the drawings used to describe the coil module
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`apparatus according to the second embodiment and dupli-
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`cated description thereof is omitted.
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`Construction of Coil Module Apparatus According to Sec-
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`ond Embodiment
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`FIG.7 is an exploded perspective view of the coil module
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`apparatus according to the second embodimentand FIG.8 is
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`a perspective view of the coil module apparatus according to
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`the second embodiment after assembly. As is understood
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`from FIG.7 and FIG.8,the coil module apparatus according
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`to the second embodimentis formed so that the components
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`from the secondary sidetransfer coil 3 to the metal sheet 9 are
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`enclosed by the rear cover 54 ofthe mobile phone unit shown
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`inT'IG. 6A and I'lG.6B and the second case piece 2 described
`above.
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`That is, the coil module apparatus according to the second
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`embodimentuses the rear cover 54 of the mobile phone unit
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`in place of the first case piece 1 described above. The coil
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`module apparatus according to the second embodiment is
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`formedso as to enclose components fromthe seco