(1)
`
`(12) Unexamined Patent
`Application Publication (A)
`
`
`
`JP 2011-210937 A 2011.10.20
`(11) Patent Application Publication No:
`Tokkai 2011-210937
`(P2011-210937A)
`
`(43) Publication date: October 20, 2011
`FI Theme code (reference)
`H01F 23/00 B
`H02J 17/00 B
`
`Examination requested: No. of Claims: 10 OL (Total 13 pages)
`(73) Applicant: 000006231
`Murata Manufacturing Co., Ltd.
`1-10-1, Higashikotari, Nagaokakyo City, Kyoto
`(74) Agent: 100117260
`Masaya FUKUNAGA, Patent Attorney
`(72) Inventor: Shinji GOMA
`Murata Manufacturing Co., Ltd.
`1-10-1, Higashikotari, Nagaokakyo City, Kyoto
`(72) Inventor: Kazuya KATO
`Murata Manufacturing Co., Ltd.
`1-10-1, Higashikotari, Nagaokakyo City, Kyoto
`(72) Inventor: Yutaka NONOGAKI
`Murata Manufacturing Co., Ltd.
`1-10-1, Higashikotari, Nagaokakyo City, Kyoto
`
`
`
`
`(19) Japan Patent Office (JP)
`
`
`
`
`(51) Int. Cl.7
`H01F 38/14
`H02J 17/00
`
`(2006.01)
`(2006.01)
`
`(21) Application No.:
` Patent Application No. Tokugan 2010-76958 (P2010-
`76958)
`(22) Date of Application: March 30, 2010
`
`(54) [Title of the Invention] Coil Module and Electronic Device Equipped With Same
`(57) [Abstract]
`[Problem] The present invention provides a coil module
`that can be made thin and compact, and an electronic
`device equipped with the coil module.
`[Solution] A coil module 1 according to the present
`invention is equipped with a flat plate-shaped coil 2, a
`circuit substrate 4 that is electrically connected to the coil
`2 and that has a plurality of electronic components
`mounted thereon that controls the electric power that is
`transmitted by the coil 2, and a flat plate-shaped resin
`structural body 3 comprising a magnetic material. The
`coil 2 is incorporated so as to be offset towards one
`surface of the resin structural body 3, the circuit substrate
`4 is disposed horizontally with respect to the coil 2, and
`at least a portion of the circuit substrate 4 is incorporated
`within the resin structural body 3.
`
`[Selected Drawing] FIG. 1
`
`
`
`
`
`
`
`
`
`
`
`
`Page 1 of 27
`
`GOOGLE EXHIBIT 1008
`
`

`

`
`
`
`(2)
`
`JP 2011-210937 A 2011.10.20
`
`[CLAIMS]
`[Claim 1]
`A coil module, characterized by being equipped with
`a flat plate-shaped coil;
`a circuit substrate that is electrically connected to the coil and that has a plurality of electronic components mounted
`thereon that controls the electric power that is transmitted by the coil; and
`a flat plate-shaped resin structural body comprising a magnetic material, and in that
`the coil is incorporated so as to be offset towards one surface side of the resin structural body; and
`the circuit substrate is disposed horizontally with respect to the coil, with at least a portion of the circuit substrate
`being incorporated within the resin structural body.
`[Claim 2]
` The coil module as set forth in claim 1, characterized in that a portion of the coil is exposed to the exterior on a surface
`side of the resin structural body.
`[Claim 3]
` The coil module as set forth in claim 1 or 2, characterized in that a portion of the circuit substrate is exposed to the
`exterior on a surface side of the resin structural body.
`[Claim 4]
` The coil module as set forth in any one of claims 1 to 3, characterized in that the resin structural body is provided
`with an opening portion in the region of the circuit substrate where the plurality of electronic components has been
`mounted.
`[Claim 5]
` The coil module as set forth in claim 4, characterized in that the resin structural body is equipped with a sealing
`material that covers the opening portion.
`[Claim 6]
` The coil module as set forth in any one of claims 1 to 5, characterized in that the circuit substrate is provided with a
`connector for connecting to the exterior.
`[Claim 7]
` The coil module as set forth in any one of claims 1 to 6, characterized in that the plurality of electronic components
`is mounted on the circuit substrate, and is electrically connected to terminals formed on the circuit substrate.
`[Claim 8]
` The coil module as set forth in any one of claims 1 to 7, characterized in that
`the coil module is further provided with a sub-circuit substrate that is electrically connected to terminals formed on
`the circuit substrate, and
`the plurality of electronic components is electrically connected to terminals formed on the sub-circuit substrate, and
`is mounted on the circuit substrate via the sub-circuit substrate.
`[Claim 9]
` The coil module as set forth in any one of claims 1 to 8, characterized in that the circuit substrate has a recessed
`portion in the horizontal direction, and the coil and the circuit substrate are disposed such that the recessed portion of
`the circuit substrate and a portion of the coil overlap.
`[Claim 10]
` An electronic device equipped with the coil module as set forth in any one of claims 1 to 9.
`[Detailed Description of the Invention]
`[Technical Field]
`[0001]
` The present invention relates to coil modules and to electronic devices equipped with coil modules, and in particular,
`to a coil module for contactless electric power transmission and an electronic device equipped with this coil module.
`[Prior Art]
`[0002]
`
`
`
`
`5
`
`10
`
`15
`
`20
`
`25
`
`30
`
`35
`
`40
`
`45
`
`50
`
`
`
`
`Page 2 of 27
`
`

`

`
`
`
`(3)
`
`JP 2011-210937 A 2011.10.20
`
`Electronic devices such as communication equipment that gets charged by transmitting electric power in a
`contactless manner have been developed in recent years. In order to transmit power in a contactless manner between
`electronic devices, it is necessary to install a coil module for contactless power transmission in both the electronic device
`on the power transmitting side and in the electronic device on the power receiving side. For example, Patent Document
`1 discloses a coil module in which a coil and a plurality of electronic components that controls the power to be
`transmitted are mounted on a circuit substrate. Further, Patent Document 2 discloses a coil module in which a circuit
`substrate on which a plurality of electronic components that controls the power to be transmitted has been mounted is
`stacked on a coil.
`[Prior Art Documents]
`[Patent Documents]
`[0003]
`[Patent Document 1] Japanese Unexamined Patent Application Publication No. Hei 07-335443
`[Patent Document 2] Japanese Unexamined Patent Application Publication No. 2005-260122
`[Summary of the Invention]
`[Problem to be Solved by the Invention]
`[0004]
` Further, in recent years, due to advances in the size and weight reduction of electronic devices, it has also become
`necessary to make the coils provided in electronic devices smaller and lighter. However, since the ability of coil modules
`to transmit power decreases with the diameter of the coil, there has been a limit to how small the diameter of the coil
`can be made. Therefore, it is important to reduce the size of the coil module by reducing its thickness while maintaining
`its ability to transmit power.
`[0005]
` For example, in the coil module disclosed in Patent Document 1, the coil is mounted on the circuit substrate and the
`coil module cannot be made thinner than the combined thickness of the coil and the circuit substrate. Further, in the coil
`module disclosed in Patent Document 2, the circuit substrate on which a plurality of electronic components has been
`mounted is stacked on the coil, and the coil module cannot be made thinner than the combined thickness of the coil and
`the circuit substrate on which the plurality of electronic components has been mounted.
`[0006]
` The present invention, devised in light of the above situation, has for its objects to provide a coil module that can be
`made thin and compact while maintaining electric power transmission capability, and to provide an electronic device
`equipped with this coil module.
`[Means for Solving the Problem]
`[0007]
`A coil module relating to a first invention for achieving the above object is equipped with a flat plate-shaped coil; a
`circuit substrate that is electrically connected to the coil and that has a plurality of electronic components mounted
`thereon that controls the electric power that is transmitted by the coil; and a flat plate-shaped resin structural body
`comprising a magnetic material, with the coil being incorporated so as to be offset towards one surface side of the resin
`structural body; and the circuit substrate being disposed horizontally with respect to the coil with at least a portion of
`the circuit substrate being incorporated within the resin structural body.
`[0008]
` In the coil module relating to a second invention, a portion of the coil in the first invention is exposed to the exterior
`on a surface side of the resin structural body.
`[0009]
` In the coil module relating to a third invention, a portion of the circuit substrate in the first or second invention is
`exposed to the exterior on a surface side of the resin structural body.
`[0010]
` Further, in the coil module relating to a fourth invention, the resin structural body in any one of the first to third
`inventions is provided with an opening portion in the region of the circuit substrate where the plurality of the electronic
`components has been mounted.
`[0011]
` Further, in the coil module relating to a fifth invention, the resin structural body in the fourth invention is provided
`with a sealing material that covers the opening portion.
`
`5
`
`10
`
`15
`
`20
`
`25
`
`30
`
`35
`
`40
`
`45
`
`50
`
`Page 3 of 27
`
`

`

`
`
`
`(4)
`
`JP 2011-210937 A 2011.10.20
`
`[0012]
` Further, in the coil module relating to a sixth invention, the circuit substrate in any one of the first to fifth inventions
`is provided with a connector for connecting to the exterior.
`[0013]
` Further, in the coil module relating to a seventh invention, the plurality of electronic components in any one of the
`first to sixth inventions is mounted on the circuit substrate and is electrically connected to terminals formed on the
`circuit substrate.
`[0014]
` Further, in the coil module relating to an eighth invention, the coil module in any of the first to seventh inventions is
`further provided with a sub-circuit substrate that is electrically connected to terminals formed on the circuit substrate,
`and the plurality of electronic components is electrically connected to terminals formed on the sub-circuit substrate and
`is mounted on the circuit substrate via the sub-circuit substrate.
`[0015]
` Further, in the coil module relating to a ninth invention, the circuit substrate in any one of the first to eighth inventions
`has a recessed portion in the horizontal direction, and the coil and the circuit substrate are disposed such that the recessed
`portion of the circuit substrate and a portion of the coil overlap.
`[0016]
` Further, the electronic device as set forth in the tenth invention is equipped with the coil module of any one of the
`first to ninth inventions.
`[0017]
` In the first invention, in a coil module equipped with a flat plate-shaped coil, a circuit substrate that is electrically
`connected to the coil and that has a plurality of electronic components mounted thereon that controls the electric power
`that is transmitted by the coil, and a flat plate-shaped resin structural body comprising a magnetic material, since the
`coil is incorporated so as to be offset towards one side of the resin structural body, the circuit substrate is disposed
`horizontally with respect to the coil, and at least a portion of the circuit substrate is incorporated within the resin
`structural body, it is possible to make the coil module thin and compact while ensuring the necessary coil diameter and
`maintaining the electric power transfer capability thereof without the coil and the circuit substrate overlapping.
`[0018]
` In the second invention, since a portion of the coil is exposed to the exterior on a surface side of the resin structural
`body in which the coil has been incorporated, it is possible to transmit electric power efficiently by transmitting electric
`power from the surface side of the resin structural body on which the coil is exposed.
`[0019]
` In the third invention, since a portion of the circuit substrate is exposed to the exterior on a surface side of the resin
`structural body in which the coil is incorporated in an offset manner, it is possible to make the coil module thinner and
`more compact by placing one surface side of the coil and one surface side of the circuit substrate on the same plane.
`[0020]
` In the fourth invention, since an opening portion has been provided in the resin structural body in the region of the
`circuit substrate whereupon the plurality of the electronic components has been mounted, it is possible to prevent the
`phenomenon (of solder flash) whereby the solder that connects the electronic components and the circuit substrate heats
`up re-melts during the process of forming the resin structural body, and seeps out into minute gaps causing short
`circuiting of the electronic components. In addition, since the plurality of electronic components is enclosed by a wall
`formed by the opening portion of the resin structural body containing a magnetic material, it becomes possible to reduce
`the effect of electromagnetic waves from the coil on the plurality of electronic components, and to achieve stable
`operation.
`[0021]
` In the fifth invention, since the resin structural body is equipped with a sealing material that covers the opening portion,
`it is possible to reduce the effect of electromagnetic waves from the coil affecting the plurality of electronic components
`via the opening portion of the resin structural body, and to achieve stable operation of the electronic components.
`[0022]
` In the sixth invention, since the circuit substrate is provided with a connector for connecting to the exterior, mounting
`the coil module on an electronic device using the connector is facilitated.
`[0023]
`
`5
`
`10
`
`15
`
`20
`
`25
`
`30
`
`35
`
`40
`
`45
`
`50
`
`Page 4 of 27
`
`

`

`
`
`
`(5)
`
`JP 2011-210937 A 2011.10.20
`
` In the seventh invention, since the plurality of electronic components is electrically connected to terminals formed on
`the circuit substrate and is mounted on the circuit substrate, it is possible to reduce the height of the circuit substrate on
`which the plurality of electronic components is mounted, thereby making the coil module thinner and more compact.
`[0024]
` In the eighth invention, since a sub-circuit substrate that is electrically connected to terminals formed on the circuit
`substrate is further provided and the plurality of electronic components is electrically connected to terminals formed on
`the sub-circuit substrate and mounted on the circuit substrate via the sub-circuit substrate, the configuration of the
`plurality of electronic components mounted on the circuit substrate can be changed simply by changing the sub-circuit
`substrate.
`[0025]
` In the ninth invention, since the circuit substrate has a recessed portion in the horizontal direction, and since the coil
`and circuit substrate are arranged so that the recessed portion of the circuit substrate overlaps with a portion of the coil,
`it is possible to shorten the combined length of the coil and the circuit substrate arranged in the horizontal direction, and
`to make the coil module compact.
`[0026]
` In the tenth invention, since the coil module of any one of the first through ninth inventions is provided, it is possible
`to make the electronic device itself thinner and smaller by making the coil module thinner and smaller.
`[Effect of the Invention]
`[0027]
` In the coil module of the present invention, which is equipped with a flat plate-shaped coil, a circuit substrate on
`which a plurality of electronic components is mounted, and a flat resin structural body containing a magnetic material,
`since the coil is incorporated in a manner offset towards one surface of the resin structural body, the circuit substrate is
`disposed horizontally with respect to the coil, and at least a portion of the circuit substrate is incorporated within the
`resin structural body, the coil module can be made thinner and smaller while securing the required coil diameter and
`maintaining the ability to transmit power without the coil and circuit substrate overlapping.
`[Brief Description of the Drawings]
`[0028]
`[FIG. 1] A plan view of a coil module according to Embodiment 1 of the present invention.
`[FIG. 1] An A-A cross-sectional view of the coil module shown in FIG. 1.
`[FIG. 3] A schematic diagram descriptive of the method of manufacturing a coil module according to Embodiment 1 of
`the present invention.
`[FIG. 4] A plan view showing the configuration of a coil module according to Embodiment 2 of the present invention.
`[FIG. 5] A B-B cross-sectional view of the coil module shown in FIG. 4.
`[FIG. 6] A plan view of a coil module according to Embodiment 3 of the present invention.
`[FIG. 7] A plan view of a coil module according to Embodiment 4 of the present invention.
`[FIG. 8] A plan view showing another configuration of a coil module according to Embodiment 4 of the present
`invention.
`[FIG. 9] A plan view showing the configuration of a coil module according to Embodiment 5 of the present invention.
`[FIG. 10] A schematic diagram descriptive of the configuration of an electronic device according to Embodiment 6 of
`the present invention.
`[Modes of Carrying Out the Invention]
`[0029]
` The coil module and the electronic device equipped with this coil module are specifically described below in
`embodiments of the present invention with reference to the drawings. The following embodiments are not intended to
`limit the invention described in the claims, and it bears repeating that not all combinations of characteristic matters
`described in the embodiments are essential to the means for solving the problems.
`[0030]
` Although the coil modules relating to the embodiments of the present invention consist of coil modules used in
`electronic devises on the power transmitting side and coil modules used in electronic devices on the power receiving
`side, in the following description, which of these types of coil module is being described shall be immaterial unless
`specifically stated otherwise.
`[0031]
`
`5
`
`10
`
`15
`
`20
`
`25
`
`30
`
`35
`
`40
`
`45
`
`50
`
`Page 5 of 27
`
`

`

`
`
`
`(6)
`
`JP 2011-210937 A 2011.10.20
`
` (Embodiment 1)
` FIG. 1 is a plan view of a coil module according to Embodiment 1 of the present invention. FIG. 1(a) is a plan view
`of a side of the resin structural body 3 on which the coil 2 is not exposed, and Figure 1(b) is a plan view of the side of
`the resin structural body 3 on which the coil 2 is exposed. FIG. 2 is an A-A cross-sectional view of the coil module
`shown in FIG. 1. As is shown in FIGS. 1 and 2, the coil module 1 is provided with a flat plate-shaped coil 2, a flat plate-
`shaped resin structural body 3 comprising a magnetic material, and a circuit substrate 4 that is electrically connected to
`coil 2 and that has a plurality of electronic components 41, ... mounted thereon that controls the electric power that is
`transmitted by the coil 2.
`[0032]
` The coil 2 is a conductor such as a copper wire wound spirally in a single plane. Further, although the coil 2 has been
`shown in the figure to have been formed in an essentially round shape, the coil 2 may also be formed in an essentially
`elliptical shape or in an essentially rectangular shape.
`[0033]
` The resin structural body 3 is a curable resin material obtained by kneading the powder of a magnetic material such
`as ferrite and molding it into a flat plate shape. In addition, the coil 2 is incorporated by offsetting it towards one surface
`(the electromagnetically coupling surface) 31 of the resin structural body 3. That is, the thickness from the coil 2 to one
`surface 31 of resin structural body 3 is made thinner than the thickness from the coil 2 to the surface on the opposite
`side of the resin structural body 3 from surface 31.
`[0034]
` In particular, in the coil module 1 according to Embodiment 1, as shown in FIG. 1(b) and FIG. 2, by reducing the
`thickness from the coil 2 to one surface 31 of the resin structural body 3, a part of the coil 2 is exposed to the exterior
`on one surface 31 of the resin structural body 3. When a portion of the coil 2 is exposed to the exterior on one surface
`31 of the resin structural body 3, since the coil 2 is covered by a curable resin containing a magnetic material on all but
`one surface 31 of the resin structural body 3, the magnetic flux generated on all the surfaces other than the one surface
`31 can be contained inside the resin structural body 3. Not only is it possible to heighten the inductance characteristics
`in the coil 2 in the direction of one surface 31 of the resin structural body 3, but it is also possible to heighten the
`magnetic shielding function of all the surfaces other than the one surface 31.
`[0035]
` The circuit substrate 4 is disposed horizontally with respect to the coil 2, and at least a portion of the circuit substrate
`4 is incorporated within the resin structural body 3. In particular, in the coil module 1 according to Embodiment 1, as is
`shown in FIG. 1(b) and FIG. 2, a portion of the circuit substrate 4 is exposed to the exterior on one surface 31 of the
`resin structural body 3. On one surface 31 of the resin structural body 3, one surface of the coil 2 and one surface of the
`circuit substrate 4 are placed on the same plane (horizontally), making it possible to render the coil module thinner and
`more compact.
`[0036]
` On circuit substrate 4 is mounted a plurality of electronic components 41 that controls the power transmitted by the
`coil 2. For example, in the coil module 1 used for the electronic device on the power receiving side, at least electronic
`components 41 consisting of a rectifier circuit, a regulator circuit, and a charging control circuit are mounted. In the coil
`module 1 used for the electronic device on the power transmitting side, at least electronic components 41 consisting of
`a power control circuit and an inverter circuit are mounted. On the circuit substrate 4 relating to Embodiment 1, plurality
`of electronic components 41, ... is not electrically connected to the terminals formed on the circuit substrate 4, but is
`electrically connected to the terminals formed on a sub-circuit substrate 42 that is electrically connected to the terminals
`formed in the circuit substrate 4, and is mounted on the circuit substrate 4 via the sub-circuit substrate 42. As a result,
`without changing the pattern of the terminals formed in the circuit substrate 4, by merely changing the sub-circuit
`substrate 42, it is possible to change the configuration of plurality of electronic components 41, ... mounted on the circuit
`substrate 4 (for example, the configuration used in the electrical equipment on the electric power receiving side or the
`configuration of the electronic device on the electric power transmitting side). Further, the circuit module (power supply
`circuit) 43 is comprised of the sub-circuit substrate 42 and plurality of electronic components 41 mounted on the sub-
`circuit substrate 42.
`[0037]
` The circuit substrate 4 is provided with a connector 44 for connection to the exterior. Using the connector 44, it
`becomes easy to connect the coil module 1 to an electronic device. The resin structural body 3 is provided with an
`
`5
`
`10
`
`15
`
`20
`
`25
`
`30
`
`35
`
`40
`
`45
`
`50
`
`Page 6 of 27
`
`

`

`
`
`
`(7)
`
`JP 2011-210937 A 2011.10.20
`
`opening portion 32 in the region of circuit substrate 4 that is provided with a circuit module 43 and a connector 44 (a
`plurality of electronic components is mounted.) By providing an opening portion 32 in the resin structural body 3, it is
`possible to prevent the phenomenon (of solder flash) whereby the solder that connects the electronic components 41
`and the sub-circuit substrate 42 heats up and re-melts during the process of forming the resin structural body 3, with the
`solder seeping out into minute gaps and causing short circuiting of the electronic components. In addition, since plurality
`of electronic components 41, ... is enclosed by the wall formed by the opening portion 32 of the resin structural body 3
`containing a magnetic material, it becomes possible to reduce the effect of electromagnetic waves from the coil 2 on
`plurality of electronic components 41, ..., and to achieve stable operation. The coil 2 is electrically connected to the
`circuit substrate 4 with a wire 21 exposed to the exterior through the opening 32 in the resin structural body 3.
`[0038]
` FIG. 3 is a schematic diagram descriptive of a method of manufacturing a coil module relating to Embodiment 1 of
`the present invention. In FIG. 3(a), a coil 2 is prepared by spirally winding a conductor such as a copper wire or the like.
`In the prepared coil 2, the wire material 21 is drawn out in one direction. In FIG. 3(b), the wire 21 that is drawn out
`from the coil 2 is connected to the coil connection terminal 45 on the circuit substrate 4 using solder or the like. In the
`circuit substrate 4 are formed wires 48 for connecting the circuit module connection terminals 46 and the connector
`connection terminals 47, respectively, in addition to connecting the coil connection terminals 45. In Figure 3(c), the
`circuit module 43 is connected to the circuit module connection terminal 46 formed on circuit substrate 4, and the
`connector 44 is connected to the connector connection terminal 47 formed on circuit substrate 4, respectively, using
`solder or the like.
`[0039]
` In Fig. 3(d), the circuit substrate to which the coil 2, circuit module 43, and connector 44 have been connected is
`placed in a mold, and the mold is filled with a curable resin containing a magnetic material that has been heated to its
`softening temperature. This is cured to form a flat plate-shaped resin structural body 3. Thus, the coil 2 and the circuit
`substrate 4 are integrated and solidified by the resin structural body 3. The mold used in Fig. 3(d) is a mold that can
`expose portions of the coil 2 and the circuit substrate 4 to the exterior on one surface 31 of the resin structural body 3,
`providing an opening portion 32 in the resin structural body 3. The circuit module 43 and the connector 44 are not
`limited to the case in which they are provided on the circuit substrate 4 before the flat plate-shaped resin structural body
`3 is formed; they can also be provided on the circuit substrate 4 after the flat plate-shaped resin structural body 3 has
`been formed. When the circuit module 43 and connector 44 are provided on the circuit substrate 4 after the flat plate-
`shaped resin structural body 3 has been formed, since the circuit module 43 and connector 44 are not affected by the
`heat generated during the formation of the flat plate-shaped resin structural body 3, it is possible to use electronic
`components 41 or connectors 44 that have little ability to withstand heat.
`[0040]
` As described above, since the coil module 1 according to Embodiment 1 of the present invention is provided with a
`flat plate-shaped coil 2, a circuit substrate 4 on which a plurality of electronic components 41, ... is mounted, and a flat
`plate-shaped resin structural body 3 containing a magnetic material; since the coil 2 is incorporated into the resin
`structural body 3 in a manner offset to one side 31 of the resin structural body 3 and the circuit substrate 4 is mounted
`in the horizontal direction with respect to the coil 2; and since at least a portion of the circuit substrate 4 is incorporated
`into the resin structural body 3, it is possible to make the coil module 1 thinner and smaller while securing the required
`diameter of the coil 2 and maintaining the ability to transmit power without the coil 2 and the circuit substrate 4
`overlapping.
`[0041]
` (Embodiment 2)
` FIG. 4 is a plan view showing the configuration of a coil module according to Embodiment 2 of the present invention.
`FIG. 5 is a B-B cross-sectional view of the coil module shown in FIG. 4. As shown in FIGS. 4 and 5, the coil module 1
`relating to Embodiment 2 is provided with, similar to the coil module 1 relating to Embodiment 1, a flat plate-shaped
`coil 2, a flat plate-shaped resin structural body 3 comprising a magnetic material, and a circuit substrate 4 that is
`electrically connected to coil 2 and that has a plurality of electronic components 41, ... mounted thereon that controls
`the electric power that is transmitted by the coil 2. In the coil module 1 shown in FIGS. 4 and 5, identical symbols have
`been used to denote constituent elements identical to those in the coil module 1 of Embodiment 1 shown in FIGS. 1
`and 2, and the detailed description thereof has been omitted.
`
`
`5
`
`10
`
`15
`
`20
`
`25
`
`30
`
`35
`
`40
`
`45
`
`50
`
`Page 7 of 27
`
`

`

`
`
`
`(8)
`
`JP 2011-210937 A 2011.10.20
`
`[0042]
` The coil module 1 in accordance with Embodiment 2 of the present invention is provided with a sealing material 5
`that covers the opening portion 32a of the resin structural body 3 in the region of the circuit substrate 4 on which the
`circuit module 43 is mounted. It is desirable for the sealing material 5 to be a material that does not allow electromagnetic
`waves to pass through it. It is, for example, a metallic film. By covering with a sealing material 5 the opening portion
`32a of the resin structural body 3 provided in the region of the circuit substrate 4 where the circuit module 43 is mounted,
`it is possible to reduce the effects of electromagnetic waves from the coil 2 on the plurality of electronic components 41
`mounted on the circuit substrate 4 through the opening portion 32a of the resin structural body 3.
`[0043]
` In the coil module 1 of Embodiment 2 of the present invention, although the opening portion 32a in the resin structural
`body 3 in the region of the circuit substrate 4 where the circuit module 43 is mounted and the opening portion 32b in
`the resin structural body 3 in the region of the circuit substrate 4 where the connector 44 is mounted are separately
`provided in order to cover without gaps the opening portion 32a in the resin structural body 3 in the region of the circuit
`substrate 4 where the circuit module 43 is mounted with the sealing material 5, the present invention is not limited
`thereto. As shown in Figure 1(a), it is also possible to provide the opening portion 32 in the resin structural body 3 in
`the region of the circuit substrate 4 in which the circuit module 43 and the connector 44 are mounted, and to cover with
`the sealing material only the region of the circuit substrate 4 in which the circuit module 43 is provided.
`[0044]
` As set forth above, since the coil module 1 in Embodiment 2 of the present invention is provided with a sealing
`material 5 that covers the opening portion 32a of the resin structural body 3, it is possible to reduce the effects of
`electromagnetic waves from the coil 2 on the plurality of electronic components 41 via the opening portion 32a in the
`resin structural body 3, and to achieve stable operation of the plurality of electronic components 41 mounted on the
`circuit substrate 4.
`[0045]
` (Embodiment 3)
` FIG. 6 is a plan view showing the configuration of a coil module relating to Embodiment 3 of the present invention.
`FIG 6(a) is a plan view showing the configuration of the coil module 1 before forming the flat plate-shaped resin
`structural body 3, and FIG. 6(b) is a plan view showing the configuration of the coil module 1 after forming the flat
`plate-shaped plastic structure body 3. As is shown in FIG. 6, the coil module 1 relating to the Embodiment 3 is provided
`with, similar to the coil module 1 relating to Embodiment 1, a flat plate-shaped coil 2, a flat plate-shaped resin structural
`body 3 comprising a magnetic material, and a circuit substrate 4 that is electrically connected to coil 2 and that has a
`plurality of electronic components 41, ... mounted thereon that controls the electric power that is transmitted by the coil
`2. In the coil module 1 shown in FIG. 6, identical symbols have been used to denote constituent elements identical to
`those in the coil module 1 of Embodiment 1 shown in FIGS. 1 and 2, and the detailed description thereof has been
`omitted.
`[0046]
` The plurality of electronic components 41 in Embodiment 3 of the present invention differs from the plurality of
`electronic components 41 in Embodiment 1 in that the electronic components are