(12)
`
`United States Patent
`Cohen et al.
`
`(10) Patent No.:
`(45) Date of Patent:
`
`US 7.494,383 B2
`Feb. 24, 2009
`
`USOO7494383B2
`
`w - W
`
`(54) ADAPTER FOR INTERCONNECTING
`ELECTRICAL ASSEMBLES
`
`(75) Inventors: Thomas S. Cohen, New Boston, NH
`SS David Manter, Windham, NH
`
`(*) Notice:
`
`(73) Assignee: Amphenol Corporation, Nashua, NH
`(US)
`Subject to any disclaimer, the term of this
`patent is extended or adjusted under 35
`U.S.C. 154(b) by 0 days.
`(21) Appl. No.: 11/880,679
`(22) Filed:
`Jul. 23, 2007
`
`(65)
`
`Prior Publication Data
`
`Jan. 29, 2009
`
`US 2009/OO296O2A1
`51) Int. C
`2006.O1
`(51) to,R o/09
`(
`.01)
`(52) U.S. Cl. ........ irr 439/638; 439/660; 439/76.1
`(58) Field of Classification Search ................. 439/638,
`439/660, 76.1, 620.07, 62005, 620.06
`See application file for complete search history.
`References Cited
`
`(56)
`
`U.S. PATENT DOCUMENTS
`6,293,827 B1 * 9/2001 Stokoe ....................... 439,608
`6,343,957 B1 * 2/2002 Kuo et al. ................... 439,638
`
`
`
`18 Claims, 13 Drawing Sheets
`
`100
`
`ll . . . . . . . . . . .
`
`- - -
`
`4/2002 Kuo ........................... 439,638
`6,364,713 B1
`6,722,897 B1 * 4/2004 Wu ...............
`... 439,761
`6,776,659 B1* 8/2004 Stokoe et al. ..
`... 439,608
`864. R. 3. Silus - - - -
`- - - 13.
`7,163,421 B1* 1/2007 Cohen et al.
`... 439,608
`2004f0072473 A1* 4, 2004 Wu ...........
`... 439,638
`2006/006864.0 A1
`3/2006 Gailus ........................ 439,608
`aS
`* cited by examiner
`Primary Examiner Gary F. Pauman
`(74) Attorney, Agent, or Firm Wolf, Greenfield & Sacks,
`P.C.
`ABSTRACT
`(57)
`An electrical COnnectOr suitable for use in an adapter. The
`connector includes conductive elements that can be routed in
`three dimensions to facilitate interconnections between con
`nectors used to form an adapter. Simplified construction is
`achieved through use of connector wafers, each of which
`route signals in a plane Such that when the wafers are orga
`nized side-by-side in a connector, signals may be routed
`through multiple parallel planes. Some of the wafers may
`include holes through which conductive elements from other
`wafers may pass, to that signal may be routed in a third
`dimension, perpendicular to the parallel planes. The adapter
`may be mounted on a printed circuit board or other substrate
`with active components. Signals may pass through the
`adapter in one of the parallel planes or may be routed for
`conditioning in the active components.
`
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`US 7.494,383 B2
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`US 7,494,383 B2
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`1.
`ADAPTER FOR INTERCONNECTING
`ELECTRICAL ASSEMBLES
`
`BACKGROUND OF INVENTION
`
`10
`
`1. Field of Invention
`This invention relates generally to electrical interconnec
`tion systems.
`2. Discussion of Related Art
`Electrical connectors are used in electronic systems to
`form connections between assemblies that are manufactured
`separately but exchange signals during operation. Frequently,
`the assemblies are formed with printed circuit boards
`(“PCBs), each of which includes a connecter that mates with
`15
`a complementary connecter on another one of the PCBs. A
`frequently used arrangement for interconnecting multiple
`PCBs is to have one PCB serve as a backplane. Other PCBs,
`which are called “daughter boards' or “daughter cards.” are
`then connected through the backplane by mating electrical
`connectors that intersect the backplane at a right angle, allow
`ing connectors on the daughter boards to be inserted into
`connectors on the backplane. For this reason, the connectors
`used to connect daughter boards to a backplane are some
`times called “right angle connectors' or “backplane connec
`tors. Similar connectors may be used in electronic systems
`with midplanes to which daughter boards may be attached on
`two sides or in other systems in which boards intersect at a
`right angle.
`Electrical connectors may also be used to join PCB’s in
`other configurations. Some electronic systems include a
`“mother board,” which contains a processor or other elec
`tronic components. Components that interact with compo
`nents on the mother board may be attached to a daughter
`board, which is frequently mounted parallel to the mother
`board. "Stacker' or "mezzanine' connectors may be used to
`join the boards in this configuration.
`Other types of connectors may be used to join other types
`of assemblies. For example, cables, with cable connectors at
`one or both ends, may be used to join assemblies that do not
`directly intersect.
`Regardless of the specific application, electronic assem
`blies frequently have connectors shaped to mate with connec
`tors on other assemblies. When the connectors on the assem
`blies are mated, conducting paths are completed through the
`connectors, providing electrical connections between the
`assemblies. However, in some instances, Subassemblies for
`which connections are desired may not have connectors con
`figured to mate with each other. In this scenario, an adapter
`may be used.
`An adapter may be an assembly with two or more connec
`tors. One of the connectors may mate with a connector on one
`of the assemblies to be joined, and another connector on the
`adaptor may mate with a connector on another of the assem
`blies. The adapter may provide conducting paths between the
`two connectors so that points on one assembly that are con
`nected to one of the connectors of the adapter are appropri
`ately connected to points on the other assembly that are con
`nected to the other connector of the adapter.
`In some systems, merely routing signals from one connec
`tor of the adapter to another is not adequate to ensure proper
`functioning of the assemblies. For example, one assembly
`may output signals of a different type or in a different form
`than is required at the input of the other assembly. Accord
`ingly, adapters may include components that modify signals
`as they pass through the adapter to ensure that each assembly
`receives signals in an appropriate form.
`
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`Regardless of the specific application of electrical connec
`tors, a connector should have electrical and mechanical prop
`erties appropriate for the system in which it will be used. One
`of the difficulties in making a connector is that electrical
`conductors in the connector can be so close that there can be
`electrical interference between adjacent signal conductors.
`To reduce interference, and to otherwise provide desirable
`electrical properties, metal members are often placed
`between or around adjacent signal conductors. The metal acts
`as a shield to prevent signals carried on one conductor from
`creating "crosstalk” on another conductor. The metal also
`impacts the impedance of each conductor, which can further
`contribute to desirable electrical properties.
`AS Signal frequencies increase, there is a greater possibility
`of electrical noise being generated in the connector in forms
`Such as reflections, crosstalk and electromagnetic radiation.
`Therefore, electrical connectors for higher speed signals are
`designed to limit crosstalk between different signal paths and
`to control the characteristic impedance of each signal path.
`Shield members are often placed adjacent signal conductors
`in a connector for this purpose.
`Although shields for isolating conductors from one another
`are typically made from metal components, U.S. Pat. No.
`6,709,294 (the 294 patent), which is assigned to the same
`assignee as the present application and which is hereby incor
`porated by reference in its entirety, describes making an
`extension of a shield plate in a connector from conductive
`plastic. U.S. Published Application 2006/0068640 and U.S.
`Pat. No. 7,163,421, which are assigned to the assignee of the
`present invention and which are hereby incorporated by ref
`erence in their entireties, also describe the use of lossy mate
`rial to improve connector performance.
`Electrical characteristics of a connector may also be con
`trolled through the use of absorptive material. U.S. Pat. No.
`6,786,771, (the 771 patent), which is assigned to the assignee
`of the present application and which is hereby incorporated
`by reference in its entirety, describes the use of absorptive
`material to reduce unwanted resonances and improve connec
`tor performance, particularly at high speeds (for example,
`signal frequencies of 1 GHz or greater, particularly above 3
`GHz).
`Other techniques may be used to control the performance
`of a connector. Transmitting signals differentially can also
`reduce crosstalk. Differential signals are carried by a pair of
`conducting paths, called a “differential pair.” The voltage
`difference between the conductive paths represents the sig
`nal. In general, a differential pair is designed with preferential
`coupling between the conducting paths of the pair. For
`example, the two conducting paths of a differential pair may
`be arranged to run closer to each other than to adjacent signal
`paths in the connector. No shielding is desired between the
`conducting paths of the pair, but shielding may be used
`between differential pairs. Electrical connectors can be
`designed for differential signals as well as for single-ended
`signals.
`Examples of differential electrical connectors are shown in
`U.S. Pat. No. 6.293.827 (the 827 patent) and U.S. Pat. No.
`6,776,659 (the 659 patent), which are assigned to the
`assignee of the present application. Both the 827 patent and
`the 659 patent are hereby incorporated by reference in their
`entireties.
`
`SUMMARY OF INVENTION
`
`The invention relates to an electrical connector design and
`an adapter that can be formed with connectors of that design.
`
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`In one aspect, the invention relates to a connector assembly
`that has conductive elements oriented in three dimensions.
`Three dimensional conductive elements may facilitate inter
`connections between connectors or interconnections of
`points on the connector to signal or power conditioning cir
`cuitry, which may facilitate design of an adapter. Accord
`ingly, in Some embodiments of the invention, an electrical
`connector includes two or more Subassemblies. A first Subas
`sembly has a first housing and a first plurality of conductive
`members, each of which has a portion disposed within the
`first housing in a first plane. The first housing has at least one
`hole perpendicular to the first plane. A second Subassembly
`includes a second housing with a second plurality of conduc
`tive members, each of which has a portion disposed within the
`second housing in a second plane. The second plane is parallel
`to the first plane. Some of the second plurality of conductive
`members extend from the second housing and through holes
`in the first housing.
`In another aspect, the invention relates to an electrical
`connector with a plurality of subassemblies. A first subassem
`bly includes a first plurality of conductive members embed
`ded in a first housing. A second Subassembly has a second
`plurality of conductive members embedded in a second hous
`ing. At least one of the second plurality of conductive mem
`bers has a portion extending from the second housing and
`25
`passing through the first housing.
`In yet a further aspect, the invention relates to an electrical
`connector with a plurality of subassemblies. A first subassem
`bly includes a first plurality of conductive members, each
`which has a first end and a second end. At least a first Subset
`of the first plurality of conductive members has a mating
`contact at each of the first end and the second end, with the
`mating contacts at the first ends being aligned in a first row
`and the mating contacts at the second ends being aligned in a
`second row, parallel to the first row. A first insulating housing
`is molded around at least a portion of each of the first plurality
`of conductive members. A second Subassembly includes a
`second plurality of conductive members, each of which has a
`first end and a second end. At least a second Subset of the
`second plurality of conductive members has a mating contact
`at each of the first end and the second end, with the mating
`contacts at the first ends being aligned in a third row and the
`mating contacts at the second ends being aligned in a fourth
`row, parallel to the third row. A second insulating housing is
`molded around at least a portion of each of the second plu
`rality of conductive members.
`
`BRIEF DESCRIPTION OF DRAWINGS
`
`The accompanying drawings are not intended to be drawn
`to Scale. In the drawings, each identical or nearly identical
`component that is illustrated in various figures is represented
`by a like numeral. For purposes of clarity, not every compo
`nent may be labeled in every drawing. In the drawings:
`FIG. 1 is a sketch of an adapter for interconnecting elec
`trical assemblies according to an embodiment of the inven
`tion;
`FIG. 2 is an exploded view of the adapter of FIG. 1;
`FIG. 3 is a sketch of a lead frame used in the construction
`of the adapter of FIG. 1;
`FIG. 4 is a sketch of a wafer incorporating the lead frame of
`FIG.3:
`FIG.5 is a sketch of a partially lossy insert used in the wafer
`of FIG. 4;
`FIG. 6 is a sketch of the wafer of FIG. 4 with the partially
`lossy insert of FIG. 5 inserted;
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`FIG. 7 is a sketch of a second lead frame used in the adapter
`of FIG. 1;
`FIG. 8 is a sketch of a wafer incorporating the lead frame of
`FIG.7;
`FIGS. 9A and 9B are sketches of caps used in the adapter of
`FIG. 1:
`FIG. 10 is a sketch of the adapter of FIG. 1 with insulating
`portions shown cutaway to reveal positions of the lead frames
`of FIGS. 3 and 7:
`FIG. 11 is a sketch of the adapter of FIG. 1 with the
`mounting bracket removed;
`FIG. 12 is a bottom view of the adapter of FIG. 1 with the
`printed circuit board removed; and
`FIG. 13 is a sketch of a cross-section through a portion of
`the wafers of FIGS. 6 and 8.
`
`DETAILED DESCRIPTION
`
`An adapter using connectors according to an embodiment
`of the invention is illustrated in FIGS. 1-13. In the embodi
`ment illustrated, the adapter is constructed from wafers, each
`of which contains multiple conductive elements arrayed in a
`plane. The wafers are aligned in a side-by-side configuration,
`positioning the conductive elements in multiple parallel
`planes.
`The conductive elements of each wafer extend from a
`housing for the wafer. The extending portions of the conduc
`tive elements may be shaped as mating contacts. Mating
`contacts extending from the housings can be captured in
`insulating caps to form electrical connectors. In the embodi
`ments illustrated, the conductive elements extend from two
`edges of the wafers, creating an adapter with connectors on
`two sides.
`The planar configuration of the wafers allows signals to be
`readily routed through the adaptor from one connector to
`another. To allow signals or power passing through the
`adapter to be modified, the wafers may be constructed such
`that signals entering the adapter in one of the parallel planes
`may be routed perpendicularly to the planes to engage a
`Substrate, such as a printed circuit board, containing compo
`nents. The components may be arranged to process signals or
`condition power levels within the adapter.
`In the drawings, the invention is illustrated in conjunction
`with an adapter having two parallel planes containing con
`ductive elements ending in two complementary connectors
`on opposite sides of the adapter. However, the invention is not
`limited in its application to the details of construction and the
`arrangement of components set forthin the following descrip
`tion or illustrated in the drawings. The invention is capable of
`other embodiments and of being practiced or of being carried
`out in various ways. Also, the phraseology and terminology
`used herein is for the purpose of description and should not be
`regarded as limiting. The use of “including.” “comprising.”
`“having.” “containing,” or “involving, and variations thereof
`herein, is meant to encompass the items listed thereafter and
`equivalents thereof as well as additional items.
`FIG. 1 illustrates an adapter 100 according to an embodi
`ment of the invention. Adapter 100 includes a first connector
`110 and a second connector 120. Such an adapter may be used
`in an electronic system to interconnect two assemblies having
`connectors that are not designed to mate with each other.
`Alternately, Such an adapter may be used to connect two
`assemblies that have connectors that are physically compat
`ible, but that operate with incompatible signal formats or
`power levels, requiring an adapter to process signals or con
`dition power passing through the adapter.
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`Regardless of why the assemblies are joined through an
`adapter, connector 110 may be configured to mate with a
`connector of one of the assemblies, and connector 120 may be
`configured to mate with a connector of another of the assem
`blies. Adapter 100 may be constructed to provide conducting
`paths between connectors 110 and 120, so that signals and
`power may be appropriately routed and conditioned within
`adapter 100. As a result, outputs of the first assembly, after
`passing through adapter 100, are appropriate for inputs to the
`second assembly, and Vice-versa.
`As an example, adapter 100 may be used in a computer
`system to connect a disk drive (not shown) or other compo
`nent to a system bus (not shown) to which the disk drive is not
`designed to directly interface. The disk drive may have a
`connector that is mechanically incompatible with a connector
`to the system bus. Alternatively or additionally, the disk drive
`may be electrically incompatible with the system bus. For
`example, a disk drive may operate at different Voltage levels
`than are available over the system bus, may employ signals
`with different formats than are communicated over the sys
`tem bus or may have a connector pin out with signal place
`ments that do not match those on a connector to the system
`bus. Adapter 100 may provide conducting paths between
`connectors 110 and 120 and may process signals or condition
`power conveyed on those paths to address any electrical or
`mechanical incompatibilities between the disk drive and the
`system bus. However, the type of assemblies connected
`through adapter 100 and the nature of the incompatibilities
`between those assemblies are not limitations on the invention,
`and any Suitable assemblies may be interconnected using an
`adapter according to embodiments of the invention.
`Adapter 100 includes conductive elements that pass
`between connector 110 and connector 120. Mating contact
`112, forming a portion of connector 110, may beat one end of
`a conductive element. Other mating contacts (not numbered)
`may similarly be at ends of other conductive elements. Some
`or all of these conductive elements may have a second end
`that forms a mating contact (not visible in FIG. 1) of connec
`tor 120. Such conductive elements may be used to route
`signals or power between assemblies without processing or
`other conditioning.
`Additionally, adapter 100 may include components that
`can provide signal processing or power conditioning when
`desired. In the embodiment illustrated, the components may
`be mounted on a substrate, such as printed circuit board 130.
`45
`To provide conditioning, some of the conductive elements
`that form mating contacts 112 within connector 110, may
`have an end connected to printed circuit board 130. Likewise,
`Some of the conductive elements that form mating contacts of
`connector 120 may also be routed to printed circuitboard 130.
`In this way, components, including active components, on
`printed circuit board 130 may condition power or process
`signals passing between connector 110 and connector 120.
`In the embodiment illustrated, adapter 100 is formed of
`multiple components. The components may be held together
`55
`in any suitable way. In the embodiment illustrated, a bracket
`140 provides mechanical support for the components of
`adapter 100. In the embodiment illustrated, pins 142 and 144
`pass through bracket 140 and other components of adapter
`100. Through the interaction of bracket 140 and pins 142 and
`144, the components of adapter 100 may be held together.
`However, any Suitable mechanism to hold the components of
`adapter 100 may be used. For example, support members in
`other shapes may be used in some embodiments, while in
`other embodiments epoxy or other adhesive materials may be
`used. Further, in some embodiments, Snap-fit, interference fit
`or other types of attachment mechanisms may be used to hold
`
`6
`the components together. Accordingly, the specific form of
`attachment used is not a limitation on the invention.
`FIG. 2 shows adapter 100 partially exploded. In the
`embodiment of FIG.2, adapter 100 is formed with two wafers
`400 and 800, which are stacked side-by-side. Further details
`of wafers 400 and 800 are shown in conjunction with FIGS. 4
`and 8, respectively. Wafer 400 includes a lossy insert 500,
`which is described in greater detail in conjunction with FIG.
`5, below.
`In the embodiment illustrated, pins 142 and 144 pass
`throughbracket 140, wafer 800, wafer 400 and printed circuit
`board 130, securing the components together. Pins 140 and
`142 may be secured in any suitable fashion. For example, pins
`140 and 142 may be secured by riveting, welding or in any
`other suitable way.
`Conductive elements may extend from wafers 400 and 800
`where connectors are formed. The extending ends may form
`mating contacts for the connectors. In the embodiment illus
`trated, adapter 100 includes two connectors and conductive
`elements extend from two sides of wafer 400, forming row
`420 and row 430 of mating contacts. Conductive elements
`likewise extend from wafer 800, forming rows 820 and 830 of
`mating contacts. Accordingly, in the embodiment illustrated,
`each of connectors 110 and 120 (FIG. 1) contains two rows of
`mating contacts.
`Separate components may provide housings for the mating
`faces of the connectors. In the example of FIG. 2, cap 910 fits
`over rows 420 and 820, forming connector 110 (FIG. 1). Cap
`910 may be made of an insulating material. Such as plastic.
`Rows 430 and 830 extending from wafers 400 and 800,
`respectively, are inserted into cap 960 to form connector 120
`(FIG.1). Cap 960 also may beformed of an insulating mate
`rial and may secure the mating contacts of rows 430 and 830
`to form connector 120 (FIG.1). Cap 960, like cap 910, may be
`made of plastic or other suitable material.
`Caps 910 and 960 may be secured to adapter 100 in any
`suitable way. In the embodiment illustrated, latch members
`210 and 220 may be used to secure caps 910 and 960. Alter
`natively, pins, screws, adhesive or other Suitable attachment
`mechanisms may be used to secure caps 910 and 960. Latch
`members 210 and 220 may be incorporated into adapter 100
`in any suitable way. For example, latch members 210 and 220
`may be held between bracket 140 and another component of
`adapter 100, such as wafer 400 and/or wafer 800. Alterna
`tively, wafer 400 and/or wafer 800 may include slots shaped
`to receive latch members 210 and 220.
`Regardless of how latch members 210 and 220 are secured,
`each of latch members 210 and 220 has latch ends extending
`toward caps 910 and 960. In the configuration illustrated in
`FIG. 2, latch ends 212 and 222, extending toward cap 910, are
`visible. Similar latch ends (not numbered) extend toward cap
`960. Each of the latch ends may include a flexible member or
`members that engage a complementary latching feature in
`one of caps 910 and 960.
`In the configuration illustrated in FIG.2, slot 230, visible in
`cap 960, forms a portion of a complementary latching feature.
`Slot 230 may provide an opening to a cavity that is larger than
`the opening itself. As a result, a lip may be formed around the
`inside of slot 230. As a latch end of latch member 210 is
`pressed into slot 230, the latch end is compressed, allowing
`the latch end to pass through slot 230. Because a latch end
`may include springy or compliant members, once the latch
`end is pressed through slot 230, it may expand and engage a
`lip around slot 230. Accordingly, when cap 960 is pressed
`toward the rest of adapter 100 including latch member 210, a
`latch end of latch member 210 may latch within slot 230.
`Latch end 212 may engage a similar slot in cap 910. Latch end
`
`30
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`35
`
`40
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`50
`
`60
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`65
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`LUXSHARE EXHIBIT 1005
`Page 17 of 23
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`

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`US 7,494,383 B2
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`7
`222 of latch member 220 may likewise engage a slot, or other
`latching feature, in cap 910. A second latch end of latch
`member 220 may similarly engage a slot, or other latching
`feature, of cap 960.
`Any suitable materials and manufacturing techniques may
`be used to form the components of adapter 100. For example,
`bracket 140 may be metal formed by molding or extrusion or
`in any other suitable way. In other embodiments, bracket 140
`may be formed of plastic or other suitable material. Pins 142
`and 144 may also be formed of metal, plastic or other suitable
`material.
`Latch members 210 and 220 may beformed of a compliant
`material, including plastic or a sheet of metal and may be
`formed by molding, stamping or other Suitable techniques.
`Caps 910 and 960 may also be molded of plastic or other
`insulating material, through parts of caps 910 and 960 could
`be conductive or partially conductive. Wafers 400 and 800
`may be made by insert molding, through any suitable con
`struction technique may be used.
`Similarly, a substrate such as PCB 130 may be formed in
`any suitable way. It may include a combination of passive and
`active components that process signals, condition power or
`perform any other desired functions.
`Turning to FIG.3, a lead frame 300 used in the manufacture
`of wafer 400 is illustrated. In the embodiment illustrated, lead
`frame 300 is one of two lead frames in adapter 100. However,
`any number of lead frames may be used and in some embodi
`ments three or more lead frames may be incorporated into
`adapter 100. Lead frame 300 may be made of any suitable
`conductive material. In the embodiment illustrated, lead
`frame 300 is stamped from a sheet of relatively springy metal,
`such as phosphor-bronze. However, other copper alloys, such
`as beryllium-copper, or any other Suitable material may alter
`natively be used. In the embodiment illustrated, lead frame
`300 contains multiple conductive elements held generally in
`the plane labeled X-Y. The conductive elements may be made
`by stamping and forming conductive elements of a desired
`shape.
`Three types of conductive elements are shown in the
`example of FIG. 3: high speed signal conductors, ground
`conductors and low speed signal conductors. In the embodi
`ments illustrated, high speed signals pass through adapter 100
`as differential signals. Differential signals are carried on pairs
`of conductors, such as pair 320A.
`Ground conductors may also be included. In the embodi
`ment illustrated, ground conductors, such as ground conduc
`tors 322A and 322B are wider than the conductors forming
`differential pairs, such as pair 320A, and wider than the
`conductors carrying low speed signals. The wide ground con
`ductors may provide a low inductance path for ground current
`to flow through adapter 100. Additionally, the ground con
`ductors are positioned between adjacent pairs of high speed
`differential conductors. With this configuration, the ground
`conductors may reduce cross-talk between high speed sig
`nals. In the embodiment illustrated, each of the differential
`pairs is between two adjacent ground conductors. For
`example, signal pair 320A is between ground conductors
`322A and 322B.
`Low speed signal conductors also traverse the X-Y plane
`between rows 420 and 430 of mating contacts. For example,
`low speed signal conductor 340 traverses the X-Y plane
`between row 420 and row 430. Conductive members for low
`speed signals may be narrower than ground conductors and
`may be the same width as high speed signal conductors.
`Though, in Some embodiments the low speed and high speed
`signal conductors may have different widths. In the embodi
`ment illustrated, low speed signal conductors can be distin
`
`40
`
`45
`
`8
`guished from high speed because the low speed signed con
`ductors are not grouped in pairs designed for preferential
`coupling with each pair separated by a ground conductor.
`However, any Suitable shape for a low speed signal conductor
`may be used.
`In use, data, Such as data being read from a disk drive at a
`high speed, may be communicated through adapter 100 on a
`signal pair. Such as pair 320A. Lower speed signals, including
`control signals and DC levels that carry power through
`adapter 100, may be routed on low speed signal conductors,
`Such as conductor 340. In some instances, conditioning or
`other processing may be desired for low speed signals. Such
`conditioning may be provided by components on a substrate
`below the X-Y plane.
`Accordingly, lead frame 300 is shown with some low speed
`signal conductors, such as low speed signal conductor 330A,
`having perpendicular portions. Such as perpendicular portion
`332A. Perpendicular portion 332A extends out of the X-Y
`plane in the Z direction. When lead frame 300 is assembled
`into an adapter such as adapter 100 (FIG. 1), the conductive
`elements extending in the X-Y plane couple signal or power
`levels between connectors 110 and 120. Perpendicular por
`tions extending in the Z direction may couple a conductive
`element to printed circuit board 130 or other component for
`processing.
`The individual conductive elements within lead frame 300
`may be held to carrier strip 310 with multiple tie bars, of
`which tie bars 312 are numbered. In the pictured embodi
`ment, lead frame 300 may be over molded with an insulating
`housing. In a finished adapter, the insulating housing may
`hold the individual conductive elements in place. Once the
`conductive elements are held by a housing, the tie bars 312
`may be severed at any suitable time, electrically isolating the
`individual conductive members within lead frame 300.
`FIG. 4 shows portions of the conductive elements in lead
`frame 300 secured within a housing 410 of a wafer 400. In the
`embodiment ill