PCI Local Bus
`Specification
`
`Revision 2.2
`December 18, 1998
`
`MICROCHIP TECH. INC. - EXHIBIT 1008
`MICROCHIP TECH. INC. V. HD SILICON SOLS. - IPR2021-01265 - Page 001
`
`

`

`Revision 2.2
`
`REVISION
`1.0
`2.0
`2.1
`2.2
`
`REVISION HISTORY
`
`Original issue
`Incorporated connector and expansion board specification
`Incorporated clarifications and added 66 MHz chapter
`Incorporated ECNs and improved readability
`
`DATE
`6/22/92
`4/30/93
`6/1/95
`12/18/98
`
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`Copyright © 1992, 1993, 1995, 1998 PCI Special Interest Group
`
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`Revision 2.2
`
`Contents
`
`Chapter 1 Introduction
`
`1.1. Specification Contents............................................................................................................ 1
`
`1.2. Motivation .............................................................................................................................. 1
`
`1.3. PCI Local Bus Applications................................................................................................... 2
`
`1.4. PCI Local Bus Overview........................................................................................................ 3
`
`1.5. PCI Local Bus Features and Benefits..................................................................................... 4
`
`1.6. Administration........................................................................................................................ 6
`
`Chapter 2 Signal Definition
`
`2.1. Signal Type Definition ........................................................................................................... 8
`
`2.2. Pin Functional Groups............................................................................................................ 8
`2.2.1. System Pins ..................................................................................................................... 8
`2.2.2. Address and Data Pins..................................................................................................... 9
`2.2.3. Interface Control Pins.................................................................................................... 10
`2.2.4. Arbitration Pins (Bus Masters Only)............................................................................. 11
`2.2.5. Error Reporting Pins...................................................................................................... 12
`2.2.6. Interrupt Pins (Optional) ............................................................................................... 13
`2.2.7. Additional Signals ......................................................................................................... 15
`2.2.8. 64-Bit Bus Extension Pins (Optional)........................................................................... 17
`2.2.9. JTAG/Boundary Scan Pins (Optional).......................................................................... 18
`
`2.3. Sideband Signals .................................................................................................................. 19
`
`2.4. Central Resource Functions.................................................................................................. 19
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`Chapter 3 Bus Operation
`
`Revision 2.2
`
`3.1. Bus Commands..................................................................................................................... 21
`3.1.1. Command Definition..................................................................................................... 21
`3.1.2. Command Usage Rules ................................................................................................. 23
`
`3.2. PCI Protocol Fundamentals.................................................................................................. 26
`3.2.1. Basic Transfer Control .................................................................................................. 26
`3.2.2. Addressing..................................................................................................................... 27
`3.2.2.1. I/O Space Decoding................................................................................................ 28
`3.2.2.2. Memory Space Decoding ....................................................................................... 28
`3.2.2.3. Configuration Space Decoding............................................................................... 30
`3.2.3. Byte Lane and Byte Enable Usage ................................................................................ 38
`3.2.4. Bus Driving and Turnaround......................................................................................... 39
`3.2.5. Transaction Ordering and Posting................................................................................. 40
`3.2.5.1. Transaction Ordering and Posting for Simple Devices .......................................... 41
`3.2.5.2. Transaction Ordering and Posting for Bridges....................................................... 42
`3.2.6. Combining, Merging, and Collapsing ........................................................................... 44
`
`3.3. Bus Transactions .................................................................................................................. 46
`3.3.1. Read Transaction........................................................................................................... 47
`3.3.2. Write Transaction .......................................................................................................... 48
`3.3.3. Transaction Termination ............................................................................................... 49
`3.3.3.1. Master Initiated Termination.................................................................................. 49
`3.3.3.2. Target Initiated Termination .................................................................................. 52
`3.3.3.3. Delayed Transactions ............................................................................................. 61
`
`3.4. Arbitration ............................................................................................................................ 68
`3.4.1. Arbitration Signaling Protocol ...................................................................................... 70
`3.4.2. Fast Back-to-Back Transactions.................................................................................... 72
`3.4.3. Arbitration Parking........................................................................................................ 74
`
`3.5. Latency ................................................................................................................................. 75
`3.5.1. Target Latency............................................................................................................... 75
`3.5.1.1. Target Initial Latency ............................................................................................. 75
`3.5.1.2. Target Subsequent Latency .................................................................................... 77
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`3.5.2. Master Data Latency...................................................................................................... 78
`3.5.3. Memory Write Maximum Completion Time Limit ...................................................... 78
`3.5.4. Arbitration Latency ....................................................................................................... 79
`3.5.4.1. Bandwidth and Latency Considerations................................................................. 80
`3.5.4.2. Determining Arbitration Latency ........................................................................... 82
`3.5.4.3. Determining Buffer Requirements ......................................................................... 87
`
`3.6. Other Bus Operations ........................................................................................................... 88
`3.6.1. Device Selection............................................................................................................ 88
`3.6.2. Special Cycle................................................................................................................. 90
`3.6.3. Address/Data Stepping.................................................................................................. 91
`3.6.4. Interrupt Acknowledge.................................................................................................. 93
`
`3.7. Error Functions..................................................................................................................... 93
`3.7.1. Parity Generation........................................................................................................... 94
`3.7.2. Parity Checking ............................................................................................................. 95
`3.7.3. Address Parity Errors .................................................................................................... 95
`3.7.4. Error Reporting.............................................................................................................. 95
`3.7.4.1. Data Parity Error Signaling on PERR# .................................................................. 96
`3.7.4.2. Other Error Signaling on SERR# ........................................................................... 97
`3.7.4.3. Master Data Parity Error Status Bit........................................................................ 98
`3.7.4.4. Detected Parity Error Status Bit ............................................................................. 98
`3.7.5. Delayed Transactions and Data Parity Errors ............................................................... 98
`3.7.6. Error Recovery .............................................................................................................. 99
`
`3.8. 64-Bit Bus Extension.......................................................................................................... 100
`3.8.1. Determining Bus Width During System Initialization................................................ 104
`
`3.9. 64-bit Addressing ............................................................................................................... 105
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`3.10. Special Design Considerations......................................................................................... 108
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`Revision 2.2
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`Chapter 4 Electrical Specification
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`4.1. Overview ............................................................................................................................ 113
`4.1.1. 5V to 3.3V Transition Road Map................................................................................ 113
`4.1.2. Dynamic vs. Static Drive Specification ...................................................................... 115
`
`4.2. Component Specification ................................................................................................... 115
`4.2.1. 5V Signaling Environment.......................................................................................... 117
`4.2.1.1. DC Specifications................................................................................................. 117
`4.2.1.2. AC Specifications................................................................................................. 118
`4.2.1.3. Maximum AC Ratings and Device Protection ..................................................... 120
`4.2.2. 3.3V Signaling Environment....................................................................................... 122
`4.2.2.1. DC Specifications................................................................................................. 122
`4.2.2.2. AC Specifications................................................................................................. 123
`4.2.2.3. Maximum AC Ratings and Device Protection ..................................................... 125
`4.2.3. Timing Specification ................................................................................................... 126
`4.2.3.1. Clock Specification .............................................................................................. 126
`4.2.3.2. Timing Parameters................................................................................................ 128
`4.2.3.3. Measurement and Test Conditions ....................................................................... 129
`4.2.4. Indeterminate Inputs and Metastability....................................................................... 130
`4.2.5. Vendor Provided Specification.................................................................................... 131
`4.2.6. Pinout Recommendation ............................................................................................. 131
`
`4.3. System (Motherboard) Specification.................................................................................. 132
`4.3.1. Clock Skew.................................................................................................................. 132
`4.3.2. Reset ............................................................................................................................ 133
`4.3.3. Pull-ups........................................................................................................................ 136
`4.3.4. Power........................................................................................................................... 137
`4.3.4.1. Power Requirements............................................................................................. 137
`4.3.4.2. Sequencing............................................................................................................ 137
`4.3.4.3. Decoupling............................................................................................................ 138
`4.3.5. System Timing Budget................................................................................................ 138
`4.3.6. Physical Requirements ................................................................................................ 141
`4.3.6.1. Routing and Layout Recommendations for Four-Layer Motherboards............... 141
`4.3.6.2. Motherboard Impedance....................................................................................... 141
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`4.3.7. Connector Pin Assignments ........................................................................................ 142
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`4.4. Expansion Board Specification .......................................................................................... 146
`4.4.1. Board Pin Assignment................................................................................................. 146
`4.4.2. Power Requirements.................................................................................................... 150
`4.4.2.1. Decoupling............................................................................................................ 150
`4.4.2.2. Power Consumption ............................................................................................. 150
`4.4.3. Physical Requirements ................................................................................................ 151
`4.4.3.1. Trace Length Limits ............................................................................................. 151
`4.4.3.2. Routing Recommendations for Four-Layer Expansion Boards ........................... 152
`4.4.3.3. Impedance............................................................................................................. 152
`4.4.3.4. Signal Loading...................................................................................................... 152
`
`Chapter 5 Mechanical Specification
`
`5.1. Overview ............................................................................................................................ 153
`
`5.2. Expansion Card Physical Dimensions and Tolerances ...................................................... 154
`5.2.1. Connector Physical Description .................................................................................. 168
`5.2.1.1. Connector Physical Requirements........................................................................ 176
`5.2.1.2. Connector Performance Specification.................................................................. 177
`5.2.2. Planar Implementation ................................................................................................ 178
`
`Chapter 6 Configuration Space
`
`6.1. Configuration Space Organization ..................................................................................... 190
`
`6.2. Configuration Space Functions .......................................................................................... 192
`6.2.1. Device Identification ................................................................................................... 192
`6.2.2. Device Control............................................................................................................. 193
`6.2.3. Device Status............................................................................................................... 196
`6.2.4. Miscellaneous Registers.............................................................................................. 198
`6.2.5. Base Addresses............................................................................................................ 201
`6.2.5.1. Address Maps ....................................................................................................... 201
`6.2.5.2. Expansion ROM Base Address Register.............................................................. 204
`
`6.3. PCI Expansion ROMs ........................................................................................................ 205
`6.3.1. PCI Expansion ROM Contents.................................................................................... 206
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`6.3.1.1. PCI Expansion ROM Header Format................................................................... 206
`6.3.1.2. PCI Data Structure Format ................................................................................... 207
`6.3.2. Power-on Self Test (POST) Code ............................................................................... 209
`6.3.3. PC-compatible Expansion ROMs................................................................................ 209
`6.3.3.1. ROM Header Extensions...................................................................................... 209
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`6.4. Vital Product Data ............................................................................................................... 212
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`6.5. Device Drivers.................................................................................................................... 212
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`6.6. System Reset ...................................................................................................................... 213
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`6.7. Capabilities List.................................................................................................................. 213
`
`6.8. Message Signaled Interrupts .............................................................................................. 214
`6.8.1. Message Capability Structure....................................................................................... 214
`6.8.1.1. Capability ID ........................................................................................................ 215
`6.8.1.2. Next Pointer.......................................................................................................... 215
`6.8.1.3. Message Control................................................................................................... 215
`6.8.1.4. Message Address.................................................................................................. 217
`6.8.1.5. Message Upper Address (Optional) ..................................................................... 217
`6.8.1.6. Message Data........................................................................................................ 218
`6.8.2. MSI Operation.............................................................................................................. 218
`6.8.2.1. MSI Transaction Termination .............................................................................. 220
`6.8.2.2. MSI Transaction Reception and Ordering Requirements .................................... 220
`
`Chapter 7 66 Mhz PCI Specification
`
`7.1. Introduction ........................................................................................................................ 221
`
`7.2. Scope .................................................................................................................................. 221
`
`7.3. Device Implementation Considerations ............................................................................. 222
`7.3.1. Configuration Space .................................................................................................... 222
`
`7.4. Agent Architecture ............................................................................................................. 222
`
`7.5. Protocol............................................................................................................................... 222
`7.5.1. 66MHZ_ENABLE (M66EN) Pin Definition .............................................................. 222
`7.5.2. Latency ........................................................................................................................ 223
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`7.6. Electrical Specification....................................................................................................... 223
`7.6.1. Overview ..................................................................................................................... 223
`7.6.2. Transition Roadmap to 66 MHz PCI........................................................................... 224
`7.6.3. Signaling Environment................................................................................................ 224
`7.6.3.1. DC Specifications................................................................................................. 225
`7.6.3.2. AC Specifications................................................................................................. 225
`7.6.3.3. Maximum AC Ratings and Device Protection ..................................................... 226
`7.6.4. Timing Specification ................................................................................................... 226
`7.6.4.1. Clock Specification .............................................................................................. 226
`7.6.4.2. Timing Parameters................................................................................................ 228
`7.6.4.3. Measurement and Test Conditions ....................................................................... 229
`7.6.5. Vendor Provided Specification ................................................................................... 231
`7.6.6. Recommendations ....................................................................................................... 231
`7.6.6.1. Pinout Recommendations..................................................................................... 231
`7.6.6.2. Clocking Recommendations................................................................................. 231
`
`7.7. System (Planar) Specification ............................................................................................ 232
`7.7.1. Clock Uncertainty........................................................................................................ 232
`7.7.2. Reset ............................................................................................................................ 233
`7.7.3. Pullups......................................................................................................................... 233
`7.7.4. Power........................................................................................................................... 233
`7.7.4.1. Power Requirements............................................................................................. 233
`7.7.4.2. Sequencing............................................................................................................ 233
`7.7.4.3. Decoupling............................................................................................................ 233
`7.7.5. System Timing Budget................................................................................................ 233
`7.7.6. Physical Requirements ................................................................................................ 236
`7.7.6.1. Routing and Layout Recommendations for Four-Layer Boards .......................... 236
`7.7.6.2. Planar Impedance ................................................................................................. 236
`7.7.7. Connector Pin Assignments ........................................................................................ 236
`
`7.8. Expansion Board Specifications......................................................................................... 237
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`Appendix A Special Cycle Messages .......................................239
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`Appendix B State Machines ......................................................241
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`Appendix C Operating Rules.....................................................251
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`Appendix D Class Codes...........................................................257
`
`Appendix E System Transaction Ordering...............................267
`
`Appendix F Exclusive Accesses...............................................279
`
`Appendix G I/O Space Address Decoding for
` Legacy Devices ....................................................285
`
`Appendix H Capability IDs..........................................................287
`
`Appendix I Vital Product Data...................................................289
`
`Glossary .......................................................................................297
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`Revision 2.2
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`Figures
`Figure 1-1: PCI Local Bus Applications .................................................................................... 2
`Figure 1-2: PCI System Block Diagram..................................................................................... 3
`Figure 2-1: PCI Pin List ............................................................................................................. 7
`Figure 3-1: Address Phase Formats of Configuration Transactions ........................................ 31
`Figure 3-2: Layout of CONFIG_ADDRESS Register............................................................. 32
`Figure 3-3: Host Bridge Translation for Type 0 Configuration Transactions
` Address Phase....................................................................................................... 33
`Figure 3-4: Configuration Read ............................................................................................... 38
`Figure 3-5: Basic Read Operation............................................................................................ 47
`Figure 3-6: Basic Write Operation ........................................................................................... 48
`Figure 3-7: Master Initiated Termination................................................................................. 50
`Figure 3-8: Master-Abort Termination .................................................................................... 51
`Figure 3-9: Retry ...................................................................................................................... 55
`Figure 3-10: Disconnect With Data.......................................................................................... 56
`Figure 3-11: Master Completion Termination ......................................................................... 57
`Figure 3-12: Disconnect-1 Without Data Termination ............................................................ 58
`Figure 3-13: Disconnect-2 Without Data Termination ............................................................ 58
`Figure 3-14: Target-Abort........................................................................................................ 59
`Figure 3-15: Basic Arbitration ................................................................................................. 70
`Figure 3-16: Arbitration for Back-to-Back Access .................................................................. 74
`Figure 3-17: DEVSEL# Assertion........................................................................................... 89
`Figure 3-18: Address Stepping................................................................................................. 92
`Figure 3-19: Interrupt Acknowledge Cycle.............................................................................. 93
`Figure 3-20: Parity Operation................................................................................................... 94
`Figure 3-21: 64-bit Read Request With 64-bit Transfer ........................................................ 103
`Fi